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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Zuken Unveils High-Speed Features for Internet-Connected PCB Design
December 18, 2019 | ZukenEstimated reading time: 2 minutes
Zuken unveils advanced high-speed design features for its recently launched eCADSTAR connected PCB design platform. eCADSTAR Advanced HS extends eCADSTAR’s connected 3D PCB design capabilities with powerful high-speed routing tools, such as length and delay-based impedance and skew control and comprehensive constraint management capabilities. With the release of eCADSTAR Advanced HS, eCADSTAR is now available in four complementary bundles that can be easily combined to meet individual profiles.
“As products become more complex and connected, high-speed design is a key part of the design and manufacturability of printed circuit boards (PCBs). High-speed components and interfaces are at the heart of today’s smart and internet-connected products, and they demand advanced requirements for layout and routing,” says John Berrie, Signal Integrity Expert, Zuken Tech Center, Bristol. “eCADSTAR Advanced HS delivers those capabilities in an easy to use environment so that PCB designers can deliver exceptional high-speed design quality.”
High-speed PCB design
The need to utilize high-speed design principles is becoming the norm rather than the exception—even if the clock-rates are not in the gigahertz range. Many of today’s common components like DDR3, DDR4 or DDR5 SDRAMs require high-speed PCB design practices to produce high-signal quality. As product performance increases and the need for device connectivity is pervasive, so is the need for high-speed constraint-driven PCB layout techniques.
eCADSTAR Advanced HS
With a consistent user interface from design entry through physical layout and a central constraint browser, eCADSTAR Advanced HS provides powerful built-in capabilities to address the complex details of critical high-speed layout and routing. Constraints can be specified both in the schematic, and the physical design tools, or as design rules stacks eCADSTAR’s built-in constraint browser. eCADSTAR’s high-speed capabilities include:
- Impedance controlled routing: In eCADSTAR, hardware engineers can constrain both single-ended and differential impedance to meet constraints on each board layer.
- Length, delay, and skew based routing: eCADSTAR works with both, length and delay constraints, including built-in simulation for detailed investigation of effects such as signal-to-signal coupling.
- Topology control: High-speed signals need a routing topology that adheres to specified constraints. eCADSTAR enables topology control with a wide selection of templates and instant visualization to make control as fast and reliable as possible.
- Handling of differential signals: In eCADSTAR differential signals can be routed with the assistance of automatic, clean end routing, specific design rules, and constraints.
Configurations and pricing
With modular bundles, eCADSTAR Base, Advanced 3D, Advanced HS, and Ultimate eCADSTAR can be configured in a wide variety of options to fit individual needs. eCADSTAR promotional pricing starts at under £2000 / €2200 EUR / $US2500.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.