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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Zuken Unveils High-Speed Features for Internet-Connected PCB Design
December 18, 2019 | ZukenEstimated reading time: 2 minutes
Zuken unveils advanced high-speed design features for its recently launched eCADSTAR connected PCB design platform. eCADSTAR Advanced HS extends eCADSTAR’s connected 3D PCB design capabilities with powerful high-speed routing tools, such as length and delay-based impedance and skew control and comprehensive constraint management capabilities. With the release of eCADSTAR Advanced HS, eCADSTAR is now available in four complementary bundles that can be easily combined to meet individual profiles.
“As products become more complex and connected, high-speed design is a key part of the design and manufacturability of printed circuit boards (PCBs). High-speed components and interfaces are at the heart of today’s smart and internet-connected products, and they demand advanced requirements for layout and routing,” says John Berrie, Signal Integrity Expert, Zuken Tech Center, Bristol. “eCADSTAR Advanced HS delivers those capabilities in an easy to use environment so that PCB designers can deliver exceptional high-speed design quality.”
High-speed PCB design
The need to utilize high-speed design principles is becoming the norm rather than the exception—even if the clock-rates are not in the gigahertz range. Many of today’s common components like DDR3, DDR4 or DDR5 SDRAMs require high-speed PCB design practices to produce high-signal quality. As product performance increases and the need for device connectivity is pervasive, so is the need for high-speed constraint-driven PCB layout techniques.
eCADSTAR Advanced HS
With a consistent user interface from design entry through physical layout and a central constraint browser, eCADSTAR Advanced HS provides powerful built-in capabilities to address the complex details of critical high-speed layout and routing. Constraints can be specified both in the schematic, and the physical design tools, or as design rules stacks eCADSTAR’s built-in constraint browser. eCADSTAR’s high-speed capabilities include:
- Impedance controlled routing: In eCADSTAR, hardware engineers can constrain both single-ended and differential impedance to meet constraints on each board layer.
- Length, delay, and skew based routing: eCADSTAR works with both, length and delay constraints, including built-in simulation for detailed investigation of effects such as signal-to-signal coupling.
- Topology control: High-speed signals need a routing topology that adheres to specified constraints. eCADSTAR enables topology control with a wide selection of templates and instant visualization to make control as fast and reliable as possible.
- Handling of differential signals: In eCADSTAR differential signals can be routed with the assistance of automatic, clean end routing, specific design rules, and constraints.
Configurations and pricing
With modular bundles, eCADSTAR Base, Advanced 3D, Advanced HS, and Ultimate eCADSTAR can be configured in a wide variety of options to fit individual needs. eCADSTAR promotional pricing starts at under £2000 / €2200 EUR / $US2500.
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.