-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation
December 19, 2019 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The latest book in I-Connect007’s The Printed Circuit Assembler’s Guide to… series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, it stands to reason that electronic circuit boards are now deployed into humid and potentially corrosive environments to a greater extent than ever before. In these harsh environments, electronics are at greater risk of electrochemical migration (ECM) failure.
Naisbitt begins The Printed Circuit Assembler’s Guide to… Process Validation with an outline of the history of contamination testing. The book’s two main technical sections then explore SIR and CAF test models for insulation resistance testing, and how to achieve Six Sigma with ionic contamination process controls.
According to peer reviewer Dr. Lothar Henneken, senior expert and six sigma blackbelt, automotive electronics at Robert Bosch GmbH, “This book is an excellent reflection of the current state of experts' views on the subject. Recent changes in IPC and IEC documents are explained in an understandable way. Many misinterpretations and emotional views, especially on ionic contamination measurement, are cleared up in a simple manner.”
Mike Cummings, a technical director at TSI, adds, “Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important.”
The Printed Circuit Assembler’s Guide to…Process Validation is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability.
Download your free copy today! You can also view other titles in our full library.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/04/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar
09/03/2025 | Global Electronics AssociationOn August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.
Standard of Friendship: Debbie McDade and Symon Franklin Went From Classmates to Colleagues
08/27/2025 | Debbie McDade, Advanced Rework Technology Ltd.As a fairly new IPC Master Trainer, I nervously attended my first IPC committee meeting in 2002 in New Orleans—a 4,600-mile trip from my home in the UK—for the IPC-610 Task Group. With more than 250 members, it was the largest IPC committee at that time.