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Signal Integrity Meets Additive Innovation in the Latest Issue

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Elementary, Mr. Watson: The Design Matrix—Revealing the Hidden Truths of Reality

05/12/2026 | John Watson -- Column: Elementary, Mr. Watson
“It seems you've been living two lives.” In one life, you're the respectable and responsible PCB design professional who follows the rules, works, pays taxes, meets deadlines, runs the checks, and even helps the landlady take out her garbage. In the other life, you’re the PCB designer who senses that something is wrong, searches for the deeper meaning behind their work, and can no longer fully accept the design world exactly as it has been presented. Welcome to the Design Matrix.

Skoltech Team Develops Modulator for Compact Photonic Integrated Circuits

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Researchers at Skoltech have developed an ultra-compact electro-optic modulator based on silicon photonics and plasmonics that enables high-efficiency optical signal control within a small device footprint.

Kitron to Expand Swedish Manufacturing Footprint

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Kitron plans to build a larger facility for its subsidiary, Kitron Eltech (formerly DeltaNordic), in Örnsköldsvik, Sweden.

Below the Surface: Looking Ahead to Where Integration Actually Happens

04/20/2026 | Chandra Gupta -- Column: Below the Surface
Progress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
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