Beyond Design: How Signals Survive the Hostile PCB Environment
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.
This issue examines how semi-additive and modified semi-additive processes are enabling finer features, tighter tolerances, and improved signal performance. Contributors break down everything from plating chemistry and microvia reliability to noise management and return-path continuity.
You’ll also find forward-looking insights on AI-driven design tools, advanced packaging, and digital twins. These technologies are reshaping how engineers approach increasingly complex systems.
The takeaway is that PCB innovation now demands a holistic view, where materials, processes, and design strategies work together to ensure performance, reliability, and scalability in next-generation electronics.
