-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs
January 8, 2020 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
![](https://iconnect007.com/application/files/3416/3132/9013/Cadence_Tensilica.jpg)
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that an implementation of the Low Complexity Communications Codec (LC3) that is expected to be compliant with LE Audio, the next generation of Bluetooth audio, is available now for Cadence® Tensilica® HiFi DSPs and has been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience. Cadence licensed reference code from Fraunhofer IIS to enable availability of LC3 in conjunction with the initial LE Audio launch, allowing customers to immediately benefit from the latest enhancements including longer battery life, improved connectivity and multi-user sharing.
“Consumer demand for a wide range of Bluetooth audio-based products from headphones and TWS ear buds to portable speakers continues to explode. We are excited that our contributions to LC3 help deliver higher quality and more robust experiences,“ said Marc Gayer, head of business department in the audio and multimedia division of Fraunhofer IIS. “We worked early on in the development of the codec to ensure that LC3 would run extremely efficiently on the Cadence Tensilica HiFi Audio DSP architecture, which translates to extended battery life for consumers.”
“The fact that the LC3 codec can provide very high-quality audio even at low bitrates makes it a key feature of the upcoming LE Audio standard,” said Mark Powell, executive director of the Bluetooth Special Interest Group (SIG). “We are pleased to see member companies working on implementations of the LC3 codec optimized for various processor architectures.”
“Fraunhofer continues to prove that it is an innovative leader in the world of audio/voice codecs with its critical contributions to the new LC3 standard,” said Gerard Andrews, director of audio/voice IP marketing at Cadence. “By working closely with Fraunhofer throughout the development of this audio codec, we are able to offer a highly optimized, ultra-low power implementation on the HiFi architecture in concert with the announcement of LE Audio. This is an example of how we’re continuing to enhance our best-in-class HiFi technology to deliver performance excellence for our customers’ audio and voice implementations.”
Tensilica HiFi DSPs are the most widely licensed audio/voice/AI speech processors. Part of the broad Cadence IP portfolio, they enable SoC design excellence in support of Cadence’s Intelligent System Design™ strategy. For more information on the Tensilica HiFi DSP family, visit http://ip.cadence.com/ipportfolio/tensilica-ip/audio.
Suggested Items
Global Sourcing Spotlight: Seven Key Challenges in Offshore Manufacturing
02/05/2025 | Bob Duke -- Column: Global Sourcing SpotlightOffshore manufacturing has long been a strategy for companies seeking cost savings and access to specialized resources. However, it comes with a unique set of challenges that can complicate operations if not managed proactively. This month, we will examine the main difficulties of offshore manufacturing and offer advice on overcoming them for global success.
Koh Young Highlights Inspection Solutions at IPC APEX EXPO 2025
02/04/2025 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for live demonstrations of its award-winning inspection technologies.
Takaya Launches High-Precision Flying Probe Test System at APEX 2025
01/27/2025 | TakayaTEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will launch the company’s new APT-2400F/APT-2600FD Series flying probe tester in Booth #3530 at the IPC APEX Expo March 18 – 21, 2025 at the Anaheim (CA.) Convention Center.
It’s Only Common Sense: You Can’t Please Everyone—Focus on the Right Customers
01/27/2025 | Dan Beaulieu -- Column: It's Only Common SenseWe often fall into the trap of trying to please everyone. While wanting to be all things to all people in our business is admirable, it’s a recipe for mediocrity. The key to long-term success is focusing on the right customers. By serving those who truly align with your strengths and goals, you can create lasting relationships, build a better reputation, and grow sustainably. Here are six strategies to help you get there.
Fuji America and Cybord Form Strategic Partnership to Deliver Visual AI-Powered Technology to SMT Production Lines
01/22/2025 | CybordReinforcing Fuji America’s commitment to industry leading solutions, this partnership will utilize Cybord’s unique technology to usher in a new era of quality in electronic manufacturing.