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GS Swiss PCB Invests in New Dynachem Vacuum and Press Lamination Lines Technology
January 9, 2020 | Automatic Lamination Technologies (ALT)Estimated reading time: Less than a minute
Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that GS (Switzerland) advance substrate manufacturer has purchased and installed Dynachem latest developed Automatic Vacuum Press Lamination line AVPL Series 2 system.
AVLP S2 is the new generation modular machine that provides customer an option to extend the system from single Vacuum stage to dual Flat Press stage lamination.
ALT – Dynachem is extremely pleased to have been selected by GS. We believe that our Dual Vacuum Press stages lamination can satisfy the high technology required in the current electronic industry, especially in the demanding substrate-manufacturing sector.
This latest AVLP line has the flexibility to manage either hot roll dry film lamination with substrate types down to 1mil core, vacuum dry film / solder mask lamination with R/Flex panel, complete coverlay lamination and curing, and vacuum & press ABF lamination for sequential build up technology.
In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch are available) and it can support the SECS/GEM protocol mostly used in the semiconductors industry.
Please feel free contact us, see for yourself, and try out samples in demonstration facility.
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