Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
GS Swiss PCB Invests in New Dynachem Vacuum and Press Lamination Lines Technology
January 9, 2020 | Automatic Lamination Technologies (ALT)Estimated reading time: Less than a minute
Automatic Lamination Technologies (ALT) under brand name Dynachem are pleased to announce that GS (Switzerland) advance substrate manufacturer has purchased and installed Dynachem latest developed Automatic Vacuum Press Lamination line AVPL Series 2 system.
AVLP S2 is the new generation modular machine that provides customer an option to extend the system from single Vacuum stage to dual Flat Press stage lamination.
ALT – Dynachem is extremely pleased to have been selected by GS. We believe that our Dual Vacuum Press stages lamination can satisfy the high technology required in the current electronic industry, especially in the demanding substrate-manufacturing sector.
This latest AVLP line has the flexibility to manage either hot roll dry film lamination with substrate types down to 1mil core, vacuum dry film / solder mask lamination with R/Flex panel, complete coverlay lamination and curing, and vacuum & press ABF lamination for sequential build up technology.
In addition the new HMI software meets the industry 4.0 requirement (data log for every production batch are available) and it can support the SECS/GEM protocol mostly used in the semiconductors industry.
Please feel free contact us, see for yourself, and try out samples in demonstration facility.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.