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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Ucamco Releases New Gerber Fabrication Documentation Specification
January 15, 2020 | UcamcoEstimated reading time: Less than a minute
Ucamco has released a new specification for fabrication documentation in Gerber. The specification defines how to transfer information in a machine-readable manner as part of Gerber fabrication data.
Read the full specification here.
Suggested Items
Revolutionizing Inner Layer Registration
12/26/2024 | Marcy LaRont, I-Connect007In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
ASMPT: Backchannel Production Planning in Electronics Manufacturing with WORKS
12/16/2024 | ASMPTThe WORKS Software Suite from ASMPT raises production planning in electronics manufacturing to a new level. With its seamless integration of ERP systems and continuous data feedback loop, the software optimizes the planning process in real time – from receiving an order to starting its production run.
PCB Cleaning Machines Market Driven by Innovation to Achieve USD 2.6 Billion Milestone by 2034
12/16/2024 | GlobeNewswireThe PCB Cleaning Machines Market is driven by the need for efficient removal of harmful residues from printed circuit boards, ensuring reliability and performance of electronic devices.