Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX
January 21, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 1-4 in Mesa, Arizona, USA.
Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges:
- Challenge: thermal conductivity. Heat dissipation is key to maintaining the longevity and reliability of devices. A pure indium Heat-Spring® offers uniform thermal resistance with minimized surface resistance and increased heat flow.
- Challenge: handling and multiple insertions. HSMF-OS is a compressible TIM with adhesive properties on just one side for easy hand placement. Its high tensile strength (approximately 90 MPA) with a soft, compliant polymer backing provides a configuration with “designed in” insertion survivability.
- Challenge: pump-out. Because Indium Corporation’s products are made of metal, they won’t pump-out, even under power cycling.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit www.indium.com/TIMs.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
Share on:
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.