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I-007e Micro Webinars Releases Part 2 in ‘Coatings Uncoated!’ Series
January 22, 2020 | The I-Connect007 TeamEstimated reading time: 1 minute

The second part of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to... Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Got five minutes? Visit iconnect007.com/webinar/cu and watch the latest segment, Never Underestimate the Importance of the Application Process, which examines the pivotal role that application plays in the overall success of coating, and presents a great opportunity to grasp the importance of the process.
I-007eBooks and I-007e Micro Webinars: Your premier educational resource for circuit board design, manufacture and assembly.
I-Connect007 takes the on-demand webinar to a new level. A perfect companion to our I-007eBook series, these bite-sized webinars are released weekly, exclusively at I-Connect007, and also available all at once for those who can’t wait for the next installment
Electrolube’s Phil Kinner has been providing I-Connect007 readers with information, guidance and practical tips on the uses and applications of conformal coatings through Team Electrolube’s “Sensible Design” columns published over the last four years. Now, in his engaging, new, 12-part webinar series, Phil will delve even deeper into the subject, examining conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Each of the 12 segments can be viewed in about five minutes.
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Rachael Temple - AlltematedSuggested Items
Coherent Announces Agreement to Sell Aerospace and Defense Business to Advent for $400 Million
08/15/2025 | AdventCoherent Corp., a global leader in photonics, today announced that it has entered into a definitive agreement to sell its Aerospace and Defense business to Advent, a leading global private equity investor, for $400 million. Proceeds will be used to reduce debt, which will be immediately accretive to Coherent’s EPS.
Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Nordson Corporation Announces Earnings Release and Webcast for Third Quarter Fiscal Year 2025
07/31/2025 | Nordson CorporationNordson Corporation today announced it will release third quarter fiscal year 2025 earnings on August 20, 2025, after the close of the market.
Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
07/28/2025 | Technica USATechnica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.