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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

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Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change. Chemistry and current density have also traditionally received much of the industry's attention in plating optimization. But what if much of that optimization could begin before any hardware, chemistry, or current density changes were made?

Heller and SEHO Investing in Mexico

09/09/2026 | Nolan Johnson, SMT007 Magazine
Heller Industries is the leading provider of thermal systems in the electronics assembly and semiconductor industries, manufacturing a wide range of equipment, primarily for standard reflow applications in electronics assembly. The company has realized significant business growth in Mexico in recent years and is now preparing for SMTA Guadalajara. Paul Lancaster, vice president of sales and marketing, spoke about the Mexican market, growing a local support infrastructure, and partnering with SEHO.

Follow the Story: AI Reshapes the Electronics Supply Chain

09/09/2026 | Michelle Te, I-Connect007
The AI infrastructure boom is creating enormous opportunities for electronics manufacturers, but its effects are spreading well beyond companies building AI servers and data centers. High performance laminates, glass fabric, copper, memory, MLCCs, foundry capacity, and other critical resources are being pulled toward fast-growing AI applications, tightening supplies and pushing up costs elsewhere in the electronics industry. I-Connect007 has been following these developments from several directions. What initially looked like separate stories about laminate availability, memory prices, component demand, PCB capacity, and data-center growth are demonstrating how AI is changing how the electronics supply chain allocates materials, capacity, and investment.

Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

Connect the Dots: What PCB Designers Should Know About Materials

09/10/2026 | Matt Stevenson -- Column: Connect the Dots
What questions does your manufacturer ask when they receive a design? I can tell you one: “How will we build this?” Every PCB design has specific parameters for elements such as impedance, thermal conductivity, and SI. Designers choose material properties based on the functionality requirements of the boards they design. Does the PCB have to operate in high heat? Be flexible enough to fit into a tiny device, such as a wearable? Maintain SI without distortion or data degradation?
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