Standard of Excellence: Collaboration—The Right Path to Innovation
Global Sourcing Spotlight: Golf, Friedman, and the Benefits of Global Sourcing
Nolan’s Notes: Coming to Terms With AINew From I-007e Micro Webinars: Part 2 in ‘Coatings Uncoated!’ Series
January 22, 2020 | The I-Connect007 TeamEstimated reading time: 1 minute
The second part of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Got five minutes? Visit iconnect007.com/webinar/cu and watch the latest segment, Never Underestimate the Importance of the Application Process, which examines the pivotal role that application plays in the overall success of coating, and presents a great opportunity to grasp the importance of the process.
In this engaging, new, 12-part webinar series, Kinner will delve even deeper into the subject, examining conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Each of the 12 segments can be viewed in about five minutes.
Share on:
Suggested Items
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
IDTechEx Report: Illuminating the Future of Lidar in Automotive
05/09/2024 | PRNewswireIn the rapidly evolving landscape of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, sensor technologies have emerged as a pivotal force driving innovations in the automotive industry.
Real Time with… IPC APEX EXPO 2024: Laser-Based Micro Machining Systems from MKS
05/06/2024 | Real Time with...IPC APEX EXPOCasey Krueger, director of product marketing for MKS, introduces their laser-based micro machining systems, particularly the CO2 drilling system for the HDI market. They discuss CO2-formed vias, the benefits of AOD technology, hypersonics, and enhanced optical transmission. The discussion also covers accuracy and the application of water-cooled galvos. Casey offers insights into the advancements and enhancements in their second-generation CO2 drilling system.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.