-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards
January 27, 2020 | IPCEstimated reading time: 2 minutes

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.
A panel of industry experts reviewed each product’s submission and chose winners in each category based on the following criteria: How is this product innovative? How is this product changing the manufacturing industry? What value will customers experience with this new product?
The Innovation Awards will be presented to the following companies on site at IPC APEX EXPO:
- ASM, for ASM DEK TQ (category: assembly equipment) -- a new printing platform for the electronics industry that increases speed and accuracy while decreasing factory footprint. DEK TQ platform offers future-proof integration into the ASM Integrated Smart Factory concept via open interfaces (IPC-HERMES-9852, close-loop-to-SPI, ASM OIB, IPC CFX).
- GreenSource Fabrication, LLC, for InduBond X-Press (category: PCB fabrication) -– a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates using induction heating that yields minimal delay in heat transfer, high heat up rates, extremely high temperatures with high temperature balance on any direction of the press stack X,Y and Z axis.
- Nihon Superior Co., Ltd., for TipSave N Flux-Cored Solder Wire (category: assembly materials) -- wire which slows the reaction and erosion of the iron from a soldering tip, especially when using lead-free solders rich in tin, increasing tip life by three times.
- Rogers Corporation, for TC350(TM) Plus Laminate (category: PCB materials) -- a thermally enhanced laminate, suited for higher power microwave and industrial heating applications requiring higher maximum operating temperatures, low circuit losses, and excellent thermal dissipation within the circuit board.
- Test Research Inc., for TR7700Q SII (category: test and inspection) -- an Industry 4.0-ready solution that performs high-speed inspection of large PCB boards up to 510 mm x 460 mm, fit for multiple applications, ranging from the telecommunications industry to the automotive industry and supporting the upcoming and innovative protocols such as IPC CFX and IPC- HERMES-9852.
- ViTrox Technologies Sdn.Bhd., for V9i Advanced Robotic Vision System (ARV), or Collaborative Robotic Arm (Cobot) (category: test and inspection) -- specializing in conformal coating inspection and thickness measurement, designed for safety and quality ensured inspection that involves co-work between a human and a robot.
“The IPC Innovation Awards recognize outstanding products and services in the electronics industry,” said John Mitchell, IPC president and CEO, “and we had a tough time choosing among the many excellent submissions we received this year. It’s exciting to see the creativity and innovation in our industry, along with the enthusiastic response to our yearly challenge.”
For more information on all IPC APEX EXPO activities, visit www.IPCAPEXEXPO.org.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,800 member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.