-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Averatek Announces A-SAP License Agreement with American Standard Circuits
January 28, 2020 | AveratekEstimated reading time: 1 minute
Averatek Incorporated has announced American Standard Circuits as an A-SAP™ licensee. A-SAP™ is an advanced PCB manufacturing technology that enables feature sizes of 25 microns and below, effectively providing PCB designers with new opportunities to address the challenges of next-generation electronics.
“American Standard Circuits' RF expertise—in combination with our long-term, relationship-driven approach to customer development—will serve the PCB design community well as we learn to fully understand all of the possible benefits of this emerging technology. Our goal at ASC is to always be at the forefront of technology, and the A-SAP™ technology allows us to do that once again. We welcome the opportunity to work with the team at Averatek and redefining the future," said Anaya Vardya, president and CEO of American Standard Circuits.
“Averatek is delighted to be working closely with American Standard Circuits” said Haris Basit, CEO of Averatek. “ASC has demonstrated significant capability in high-performance and high-frequency PCBs and Averatek’s ultra-high-density A-SAP™ process represents a strong complementary capability to support next-generation electronics requirements.”
Averatek’s A-SAP™ is an advanced manufacturing process for printed circuit board fabrication with trace and space widths as narrow as 15 microns. This process can dramatically reduce the area, layer count, and weight of electronics systems as well as provide significant RF benefits. A-SAP™ has been designed to be easily integrated with traditional PCB manufacturing equipment and materials.
About Averatek
Averatek Corporation develops and licenses advanced manufacturing processes for a variety of electronic products, including very high-density printed circuit boards, semiconductor packaging, and RF and millimeter-wave passive components. In addition, Averatek develops and sells the key chemistry that enables these advanced manufacturing processes. For more information, visit www.averatek.com.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
The Power Shift in U.S. Manufacturing Ownership
08/20/2025 | Nolan Johnson, I-Connect007The U.S. manufacturing landscape is driven by reshoring initiatives, supply chain realignments, and a surge of foreign interest. What does that mean for U.S.-based PCB and EMS companies? In this interview, mergers and acquisitions expert Tom Kastner breaks down the forces reshaping the industry—why foreign investors are eager to enter the U.S. market, why many are evaluating greenfield facilities over acquisitions, and why the high-mix, low-volume focus of most domestic shops doesn’t always align with foreign buyers’ goals.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
Kimball Electronics Mexico Hosts First-Ever Charity Run in Reynosa to Support Children Battling Cancer
08/19/2025 | Kimball ElectronicsKimball Electronics Mexico (KEMX) proudly organized its first-ever Charity Run at the Polideportivo of Reynosa, bringing together employees and their families for a meaningful cause.
Green Electronics Manufacturing Market to Grow $131.64 Billion by 2032, at 25.83% CAGR
08/19/2025 | Globe NewswireThe Green Electronics Manufacturing Market size was valued at USD 21.00 billion in 2024 and is expected to reach USD 131.64 billion by 2032, growing at a CAGR of 25.83% over the forecast period of 2025-2032.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.