-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Machine Vision Products Introduces Versa AOI/SPI Solution
February 3, 2020 | Machine Vision ProductsEstimated reading time: 2 minutes
Building on MVP’s 25 years’ experience of innovative Automated Optical Inspection the Versa system brings the latest 3D technologies to MVPs SMT and SPI offerings and is a significant advance in the flexibility of PCB assembly inspection.
Uniquely, MVP’s Versa system allows fast programming and the flexibility to fit into all the processes in the line: Paste Inspection, Pre-Reflow, Post-Reflow, Post-Wave and Selective Solder.
The Versa system, is the first introduction in a new series of MVP 3D AOI products distinguished by: high-performance defect detection, lowest over-rejection and a low cost of ownership. With the enhanced 3D capabilities, the Versa maintains MVP’s flagship process flexibility and scalability.
Cultivating on our expertise in defect detection for SMT and microelectronics inspection, MVP’s Versa allows for versatile program strategies in a single software toolset.
Using MVP’s ease-of-use ePro software guides you through the program generation process allowing for each inspection strategy to be developed quickly and automatically.
Import capabilities include Gerber, ODB++ and a variety of other formats. Combined with MVP’s leading-edge optimization tools for high performance and minimized over rejection, ease-of-use and rapid programming has been a paramount objective for our latest software suite.
Designed with future technology trends in mind, Versa’s 3D and optical capabilities provide high accuracy measurement capabilities for all current and future paste and SMT inspection. The Versa has multiple 3D options for even the most complex of inspection challenges
Using standard software and hardware across the Versa’s cross-process capability allows you to reduced support costs as you only need to provide support and training for a single platform vs. multiple different system. MVP’s leading reliability allows you to obtain the highest performance and uptime from your investments.
Visit MVP at IPC Apex 2020 at booth 1800 to see and have a demonstration of our latest SMT and Microelectronics Inspection Solutions.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.