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DuPont Introduces New Pyralux and Riston Products
February 3, 2020 | DuPontEstimated reading time: 1 minute
DuPont Interconnect Solutions announced today that it is introducing several new products across its DuPont™ Pyralux® and Riston® product families to address a diverse set of needs for both the manufacture and performance of advanced electronics devices. DuPont will showcase these new products and many other innovations at the upcoming IPC APEX tradeshow in San Diego, California, Feb. 4-6, booth #4118.
“DuPont Interconnect Solutions is focused on helping our customers push performance boundaries, while also meeting complicated processing demands,” said Andy Kannurpatti, West Business Leader, DuPont Interconnect Solutions. “With the introduction of these newest products, we are demonstrating again our resolve to create novel solutions that meet the needs of our customers today and in the future.”
DuPont’s newest product innovations include:
- Pyralux® AG – an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume consumer, medical and automotive applications.
- Pyralux® GPL – an adhesive that is specifically formulated for high-speed, high-frequency flexible circuit applications; it has outstanding thermal resistance, peel strength and UV laser drilling process capability.
- Riston® DI3000 – multi-wavelength, dry-film photoresist for pattern plating on multi-layer boards. High adhesion and chemical resistance delivers yield by eliminating lifting and breakdown defects in copper, tin or gold.
- Riston® DI5100 – optimum solution for the mSAP process. Made for smooth copper high adhesion on isolated resist lines, this film delivers the ultimate high density circuits made today.
- Riston® DI9200 – high density interconnect film for print and etch process. High resolution and adhesion, combined with excellent lamination conformation, ensures high yields. Fast photospeed at multiple LDI wavelengths ensures high productivity.
DuPont Interconnect Solutions brings a deep understanding of materials science to the printed circuit board (PCB) market. We provide materials that support all aspects of PCB manufacturing for many types of PCBs: single- or double-sided boards and flexible, rigid-flex, or rigid configurations.
As a market leader in flexible PCB laminates, dry film photoresists and high-reliability metallization, we allow our customers to push the design envelope and create products that perform faster and more reliably.
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Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.