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IPC APEX EXPO 2020 Dawns on San Diego
February 4, 2020 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute

The sun rises on IPC APEX EXPO this fine Tuesday in San Diego, California, climbing as it does toward its own apex. And with the dawn of a new day comes opportunity, freshness, and progress. This year marks the 20th year of IPC APEX EXPO, and brings that same freshness, progress and opportunity that greets us with the dawn. Even as the show was setting up, technical meetings had already begun.
Progress is already underway! Early reports around the event suggest we'll be hearing about increased precision from equipment, and greater problem solving from software. All these rapidly iterating improvements take us closer to the yields, production volumes and densities our customers strive for.
What? No big revolution? Maybe. Maybe not. We'll see what happens. If not, that's okay. The sun doesn't always rise on a brand new world; it does, however, always bring a new day full of promise. Join us at the San Diego Convention Center through Thursday or follow along at www.iconnect007.com and www.realtimewith.comas we report throughout the week.
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.