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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Keysight Technologies to Showcase Test Solutions for Automotive Electronic Systems, IoT Systems and Consumer Devices at embedded world 2020
February 10, 2020 | Keysight Technologies, Inc.Estimated reading time: 1 minute
At embedded world 2020, attendees can experience Keysight's range of revolutionary products and services which are helping innovators develop new products. Keysight's unique expertise in digital technologies, as well as in radio frequency (RF) and microwave, help designers deliver their embedded design products to market quickly.
At Stand #4-208, Keysight will showcase test solutions that accelerate time-to-market of automotive electronic systems, IoT systems and consumer devices, including:
Memory Design, Signal and Power Integrity—New PathWave ADS Software
- Predicts performance, optimizes designs and performs virtual transmitter compliance test before realizing the first hardware prototype.
- Reduces simulation setup time from hours to minutes with new features such as Double Data Rate (DDR) components, smart wires and an intelligent memory probe.
- Increases simulation accuracy for DDR5 by representing receiver equalization with IBIS Algorithmic Modeling Interface (IBIS-AMI) models, enhanced specifically for DDR requirements.
Mission-Critical IoT Test Solutions
- Deliver insights to detect design weaknesses through event-based power consumption analysis and battery life estimation.
Affordable, Feature-Rich Oscilloscopes
- Deliver hardware and software needed for embedded and other applications—offering power and ease-of-use, as well as a consistent interface across the range of solutions.
RF and Microwave Test Solutions
- Include signal analyzers and signal generators equipped with the latest software to remain in sync with changing wireless technology while meeting compliance standards.
- Characterize complex modulation schemes required by newer standards.
Power Integrity and Crosstalk Removal Oscilloscopes
- Provide cutting edge hardware and a broad suite of software that work together to deliver unmatched measurement capability.
- Offer a comprehensive set of probing, analysis applications and measurements for advanced technologies.
Power Consumption and Current Drain Analysis Solutions
- Deliver powerful analysis of devices, from small low-current battery-operated devices to larger 2 kW devices running on up to 200A.
- Address dynamic current analysis and provides instant and clear visualization of current consumption during operation.
Keysight Services
- KeysightCare—a unique service model that offers design and test engineers dedicated, proactive support for instruments, software and solutions that enhance processes and transform test asset insights into improved return on investment.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.