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Flex Talk: Additive PCB Technology for Next-generation Electronics

Semi-additive PCB processes help to enable very fine features, with trace and space down to 25 microns and below, significantly reducing space and weight for next-generation electronics. Tara Dunn speaks with Todd Brassard and Meredith LaBeau from Calumet Electronics about how the company is the first domestic PCB manufacturer to license Averatek’s A-SAP™ process and will be presenting information on the industrialization of this process at this year’s IPC APEX EXPO.

Tara Dunn: Thank you for taking the time to talk with me about Calumet Electronics and some of the exciting things you have going on at IPC APEX EXPO this year. Can you provide a little bit of background about Calumet Electronics and your roles there?

Todd Brassard: Thanks, Tara. I serve as the VP and COO at Calumet Electronics.

Meredith LaBeau: And I am the director of process engineering and one of the chief strategic planners.

Brassard: Calumet Electronics has a great story dating back to 1968, preceded by 100 years of copper mining. Our company’s founding mission was to provide jobs to the region as the copper mines closed. This remains a strong component of our mission still, which is to provide careers for good people. Today, Calumet Electronics has grown and evolved to be among the healthiest and strongest PCB manufacturers in the country. Calumet is fiercely focused on strengthening the domestic electronics industry and solving problems for our North American customers.

LaBeau: In 2013, Calumet Electronics restructured to modernize the management team to meet the needs of the technology and job market. Calumet transitioned its focus from the head down to growing technological capabilities side by side with OEMs and other customers. Our technology has significantly evolved over the past six years, positioning Calumet to compete at the highest levels for all customers, but especially the aerospace and defense market. Calumet is also developing technologies that could reset the technology curve and bring semi-additive processing in volume to the United States.

To read this entire column, which appeared in the January 2020 issue of PCB007 Magazine, click here.