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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Mike Casper Appointed Group Applications Engineer at TAKAYA
February 25, 2020 | TakayaEstimated reading time: 1 minute
Mike Casper has been appointed Group Applications Engineer for TAKAYA flying probe test systems by TEXMAC, the exclusive authorized distributor of TAKAYA flying probe test systems in North America. In his new position, Mike will be responsible for Pre-sales evaluations and Post-sales customer support including training, service, and applications. TAKAYA is the inventor and industry leader in flying-probe test technology for more than 25 years.
In making the announcement, Roy McKenzie, Takaya Group Manager for TEXMAC Inc., said, “Mike is a great asset to our customers thanks to his extensive experience in our industry. He spent 15 years in a very similar position with another flying probe test company providing customer support for flying probe and functional test applications. Prior to that Mike spent 20 years developing functional test hardware and software for a number of different companies and product types. He brings tremendous talent and experience to his new position. We’re pleased to welcome him to the TEXMAC team.”
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Sweeney Ng - CEE PCBSuggested Items
BAE Systems Provides Advanced Aircraft Readiness with New Link 16 Test Capability for F-16
05/14/2026 | BAE SystemsBAE Systems has completed the successful development and integration of an upgraded Link 16 test capability for Multifunctional Information Distribution System Joint Tactical Radio System (MIDS JTRS) terminals on U.S. Air Force F-16 aircraft.
Separating Fact from Fear on the FCC ‘China Lab Ban’
05/14/2026 | Jan Pedersen, NCAB GroupRecent news headlines have suggested that the U.S. Federal Communications Commission (FCC) has “banned all testing laboratories in China and Hong Kong.” Understandably, this has created concerns around PCB testing, material approvals, UL listings, and the continued use of established test laboratories in Asia. The good news is that for most PCB, PCB material, and PCBA testing, nothing has changed. Let’s separate fact from fear.
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
SPEA Expands Global Footprint with New Hub in Santa Clara, Silicon Valley
05/08/2026 | SPEASPEA has officially landed in the heart of Silicon Valley, with the grand opening of its newest facility in Santa Clara, California.
More Than Electrical Test: TTCI to Spotlight X-ray and CT Capabilities at SMTA Capital Expo
05/07/2026 | TTCIThe Training Connection LLC (TTC-LLC) will exhibit at the SMTA Capital Expo on Thursday, May 14 at the DoubleTree by Hilton Baltimore - BWI Airport.