Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Have SPI and AOI but not RPI? Meet KiC at SMTA Chihuahua
February 26, 2020 | KIC ThermalEstimated reading time: Less than a minute
KIC announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, March 19, 2020 at the Villarreal Eventos in Chihuahua, CP. Miguel Carbajal, KIC’s Mexico Sales Manager, will discuss the company’s Smart Factory solutions that provide process control, traceability, automation, connectivity, data collection and analytics, and fast and easy integration for i4.0.
Have SPI and AOI but not RPI? Find out what you’re missing without Reflow Process Inspection. With RPI i4.0, and KIC’s NPI and process setup tools, all relevant data can connect to the factory MES or your factory data collection system to be easily analyzed and shared with personnel for clear factory analytics, optimization and corrective action.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight. For more information about KIC, visit www.kicthermal.com.
Share on:
Suggested Items
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.