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The Latest in Automation
When customer requirements shift, responses range from new equipment to automation. Explore the newest solutions reshaping production and how today’s market dynamics are driving these trends.
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Have SPI and AOI but not RPI? Meet KiC at SMTA Chihuahua
February 26, 2020 | KIC ThermalEstimated reading time: Less than a minute
KIC announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, March 19, 2020 at the Villarreal Eventos in Chihuahua, CP. Miguel Carbajal, KIC’s Mexico Sales Manager, will discuss the company’s Smart Factory solutions that provide process control, traceability, automation, connectivity, data collection and analytics, and fast and easy integration for i4.0.
Have SPI and AOI but not RPI? Find out what you’re missing without Reflow Process Inspection. With RPI i4.0, and KIC’s NPI and process setup tools, all relevant data can connect to the factory MES or your factory data collection system to be easily analyzed and shared with personnel for clear factory analytics, optimization and corrective action.
Move toward the future of line connectivity, flexible production, machine learning and real-time insight. For more information about KIC, visit www.kicthermal.com.
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Technica USA and Wise Deepen U.S. Market Collaboration and Service Initiatives
12/09/2025 | Technica USAJason Perry, President of Technica USA, recently visited longtime supply partner Wise at its headquarters in Parma, Italy, following the Productronica exhibition. During the visit, Perry met with Wise’s executive management team to review strategic initiatives and discuss emerging technologies planned for 2026 and beyond.
Driving Innovation: The Flash Cutting Process
12/08/2025 | Simon Khesin -- Column: Driving InnovationDuring the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.
Real Time with... productronica 2025: Polar on Understanding Material Libraries in Design
12/04/2025 | Real Time with...productronicaPete Starkey and Martyn Gaudion discuss the rapid updates in material libraries and the critical need for designers to grasp material properties. They highlight the role of suppliers and the importance of communication between designers and fabricators. Martyn focuses on the educational aspect of their services, aiming to connect design and manufacturing. The conversation underscores the significance of material knowledge in enhancing the design process through collaboration.
Real Time with... productronica 2025: KYZEN's Approach to Innovative Cleaning Solutions for Electronics
12/01/2025 | Real Time with...productronicaIn this interview by Pete Starkey at productronica 2025, Jayson Moy shares insights on KYZEN's environmentally responsible cleaning products tailored for the electronics industry. Their discussion covers the challenges of meeting European market demands and adapting to regulations. KYZEN introduces products like the AQUANOX A4618, focusing on custom solutions and process control systems that ensure chemical concentration reliability.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.