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Jason Perry, President of Technica USA, recently visited longtime supply partner Wise at its headquarters in Parma, Italy, following the Productronica exhibition. During the visit, Perry met with Wise’s executive management team to review strategic initiatives and discuss emerging technologies planned for 2026 and beyond.

Driving Innovation: The Flash Cutting Process

12/08/2025 | Simon Khesin -- Column: Driving Innovation
During the creation of a multilayer board, the lamination process naturally results in excess resin (known as "flash)" being squeezed out and solidified along the sides of the PCB panel. While the consistency and size of this flash provide process engineers with valuable insight into lamination parameters, the flash itself must be completely removed before subsequent manufacturing steps.

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Connect the Dots: The Future of Designing for Reality—Electroless Copper

11/26/2025 | Matt Stevenson -- Column: Connect the Dots
On a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity. 
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