-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Showcases at Eastern European Trade Fairs
March 2, 2020 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Two important trade fairs for the Eastern European electronics industry—AMPER in Brno (Czech Republic) and ElectronTechExpo in the Russian capital of Moscow—are coming up in March and April. As an established manufacturer of reflow soldering systems as well as for conformal coating processes in the protective coating sector, Rehm Thermal Systems has also made a name for itself on the Eastern European electronics market in recent years and will thus once again be showcasing its products at trade fairs in the Czech Republic and Russia.
AMPER, held in Brno in the Czech Republic, is one of the largest trade fairs for the European electronics industry. Rehm Thermal Systems is presenting a CondensoXC for condensation soldering, among other products, on 17?20 March in Hall F, Stand F4.01. CondensoXC impresses users with its optimum process performance. Exact profiling by means of the injection principle and the option of soldering under an inert atmosphere provide optimum soldering results. Void-free soldering can also be carried out easily with the vacuum option, which increases the reliability of assemblies significantly. With a footprint of just 2.3 m², this system is specially designed for small series and is also ideal for prototype production. As a batch system, it can be used flexibly, irrespective of the production environment.
Rehm Thermal Systems will once again exhibit its product portfolio at Russia’s largest electronics trade fair, ElectronTechExpo. Interested visitors can drop by to have a look at Rehm in Pavilion 3, Hall 14, Stand A1033 from 14 to 16 April. Alongside a CondensoXC condensation soldering system, a ProtectoXC will also be showcased at the stand. With ProtectoXC, Rehm has brought a compact and high-performance coating system to the market, which is primarily suitable for small and medium batch sizes. When developing ProtectoXC, the focus was on ensuring that the system features a modern look and intuitive operation, whilst also providing reliable protection for high-quality circuit boards. Rehm will present the ProtectoXC with ViCON system software at the ElectronTechExpo. The use of touch operating elements and gestures as well as the new organisation of menu options and control panels were the key factors in the development of the ViCON software.
About Rehm Thermal Systems
Rehm is a technology and innovation leader in the state-of-the-art, cost-effective manufacturing of electronic assembly groups. It specialises in thermal system solutions for the electronics and photovoltaics industry. Rehm is a globally active manufacturer of reflow soldering systems using convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallisation of solar cells and numerous customised systems. We have a presence in all key growth markets and, as a partner with 30 years of industry experience, implement innovative production solutions that set new standards.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.