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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Sign Up Now for April 2 EMA Webinar on DDR Design GuidelinesMarch 26, 2020 | EMA Design Automation
Estimated reading time: Less than a minute
Each time a new generation of DDR is released, its performance capabilities are almost 2x superior to the previous generation. These technological advancements mean more difficult design requirements and tighter tolerances for PCB designers to navigate.
Join EMA Design Automation on April 2 at 3 pm Eastern time to learn how to overcome common challenges and helpful design techniques when incorporating DDR4 into your next design.
What attendees will learn:
- DDR4 overview and structure
- Common challenges when incorporating DDR into your design
- Electrical and layout techniques to address the challenges
- Defining and meeting constraint requirements
- Verifying proper interface operation
- What’s to come with DDR5
The webinar presenters are Jerry Long, product and senior applications engineer, and Orlen Bates, field applications engineer, both with EMA.
For more information, or to register, click here.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.