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Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
June 24, 2024 | KICEstimated reading time: 1 minute
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing. The recognition award was presented to KIC President/Owner Philip Kazmierowicz and General Manager Miles Moreau for KIC's dedication to sharing expertise and knowledge for the betterment of the industry.
KIC has been a leader in the industry for 47 years, driving advancements that help manufacturers harness the power of data to create flexible, efficient and successful operations. The company is at the forefront of the 'smart factory' revolution, providing customers with the tools and knowledge necessary to navigate and excel in this new era of intelligent manufacturing.
“We are honored to receive this recognition from IPC," said Miles Moreau. "KIC not only pushes to innovate new technologies and solutions but feels a responsibility to share and contribute to the industry that we work in. We will continue to actively participate in IPC committees and standards development to support the industry as a whole”.
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Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
11/05/2025 | MycronicMycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.