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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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ExpressPCB Now Offers Live ChatMarch 30, 2020 | ExpressPCB
Estimated reading time: 1 minute
ExpressPCB®, the easiest circuit board design software to learn and use, is excited to expand their online service with the addition of Live Chat on their website, www.expresspcb.com. From the company’s website, customers will be able to chat quickly and efficiently with an ExpressPCB support representative. The new service provides one-on-one, real-time interaction for customers.
“We continually strive to meet or exceed our customer’s expectations, whether in regards to our schematic and layout design software, printed circuit board manufacturing, or customer support. Adding Live Chat allows customers a more direct line to solutions, which saves time and keeps projects moving forward,” said Michael Hebda, ExpressPCB’s Product Manager. “Our customers have regularly touted our customer support, and we look forward to elevating their experience.”
ExpressPCB continues to add features and services that allow Design Engineers to be as efficient as possible. We help bring your ideas to life with free CAD Software, coupled with the highest quality, and lowest US based manufacturing costs possible.
ExpressPCB® is an established leader in providing software and manufacturing solutions for high quality, low cost, and quick turnaround prototyping. With more than 20 years of experience and over 1 million successfully completed PCB projects behind us, our customers have experienced the difference that we bring in the electronics industry. ExpressPCB is committed to improving the overall process for design engineers of all levels and abilities with the fastest to learn layout software available with seamless integration to PCB ordering and manufacturing.
ExpressPCB’s Schematic and Layout tools are simple and unencumbered by multiple layers of menus, options and settings that more advanced PCB Design suites require mastering before you even start on your design project.
If time is of the essence and there is a need to quickly turn out a prototype to get a project off the ground, then ExpressPCB is the only choice.
For more information about ExpressPCB’s PCB solutions, please visit www.expresspcb.com. Trademarks: ExpressPCB® is trademarked by ExpressPCB, LLC.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.