-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Advances in Medical Diagnostics Using LoC and LoPCB Technologies
March 31, 2020 | Pete Starkey and Happy Holden, I-Connect007Estimated reading time: 14 minutes
Figure 8: The experimental LoPCB biosensing platform; (a) integrated LoPCB stackup; (b) electrochemical impedance spectroscopy electrode configuration; (c) commercially fabricated PCB biosensing platform; (d) sample delivery microfluidics [4].
Dr. Moschou’s recent work is shown in Figure 9, which is a three-layer multilayer experiment where the construction is:
- Layer 1: Reference layer plated with copper, silver, and silver chloride (Figure 5b&c)
- Layer 2: Sensing electrodes plated with hard gold
- Layer 3: the microfluidic layers for the sample solution
A 3D exploded view, as well as the plated layers, are also shown. The experimental test board proved very successful, so a full LoPCB substrate was designed (Figure 10). This fully integrated PCB cartridge (4.6 cm x 5.7 cm) includes the microfluidic channels for handling the sample, reference electrodes, and working electrodes. It is designed to measure the biomarkers for the test for tuberculosis. In addition to the three-layer construction, the cartridge contained:
- PCI express electrical interfacing
- Six channels (four standard curve points within the clinical range, one negative control, and one sample)
- 10 µL reaction chambers
- Three amperometric sensors per channel
- Full assay implemented on the PCB
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.