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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Sign Up For Mentor's Webinar on April 28: Save Time Using Constraint ManagementApril 16, 2020 | Mentor, a Siemens business
Estimated reading time: Less than a minute
When advanced technologies are utilized in a design, more sophisticated rules and constraints are needed. Some constraints may be more physical, such as traces and nets that must be routed on a specific layer, or need to be restricted to a certain area of the board. These may be easy to keep track of manually for a few nets, but if you have hundreds, even thousands of complex constraints, you need an automatic way to manage and adhere to these during design.
Register for this live webinar to see how RF Laboratories, Inc used constraint management to cut down on design iterations, saving time and cost.
What You Will Learn
- How a long time PADS user utilizes the constraint management to reduce design iterations and speed up design time.
- How RF Laboratories, Inc. defined complex constraints.
- How they successfully navigated adhering to constraints during placement, routing and even when editing traces with push-and-shove techniques.
Who Should Attend
- PCB designers
- Electrical engineers
- CAD managers
This webinar is scheduled for April 28, 2020, from 10:00-11:00 am Eastern. For more information or to register, click here.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.