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Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Keysight Webinar May 6: Get Ready for Gen5 With PCIe and DDR
April 23, 2020 | Keysight TechnologiesEstimated reading time: Less than a minute
This Keysight seminar will be held May 6, 2020. Presenters will cover test and validation methodologies, with best-practice examples, to help PCIe 5.0 and DDR5 technology adopters fully test all key measurement parameters to ensure their design meets the specification requirements.
Attendees will learn the following:
- Evolution of PCIe and DDR technologies
- PHY Layer testing challenges at 32 GHz NRZ and 64 GT/s
- Looking forward to PAM4 technologies
- TX and RX test solutions for PCIe 5.0 and DDR5 Devices
- Simulation and verification environments
- New requirements for DDR5 simulation
AGENDA
- 10:00 am PT / 1:00 pm ET
Leading Edge + Mainstream Technologies: Everything is Moving to Next Generation - 10:30 am PT / 1:30 pm ET
Master PCIe Transmitter and Receiver Measurement Techniques - 11:45 am PT / 2:45 pm ET
Latest DDR5 Developments – Planning for DDR6
For a more detailed agenda, please click here.
Suggested Items
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07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.