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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Keysight Webinar May 6: Get Ready for Gen5 With PCIe and DDRApril 23, 2020 | Keysight Technologies
Estimated reading time: Less than a minute
This Keysight seminar will be held May 6, 2020. Presenters will cover test and validation methodologies, with best-practice examples, to help PCIe 5.0 and DDR5 technology adopters fully test all key measurement parameters to ensure their design meets the specification requirements.
Attendees will learn the following:
- Evolution of PCIe and DDR technologies
- PHY Layer testing challenges at 32 GHz NRZ and 64 GT/s
- Looking forward to PAM4 technologies
- TX and RX test solutions for PCIe 5.0 and DDR5 Devices
- Simulation and verification environments
- New requirements for DDR5 simulation
- 10:00 am PT / 1:00 pm ET
Leading Edge + Mainstream Technologies: Everything is Moving to Next Generation
- 10:30 am PT / 1:30 pm ET
Master PCIe Transmitter and Receiver Measurement Techniques
- 11:45 am PT / 2:45 pm ET
Latest DDR5 Developments – Planning for DDR6
For a more detailed agenda, please click here.
The iNEMI Connector Reliability Test Recommendations Project, Phases 1 through 3, addressed the need for a standardized reliability evaluation method for connectors.
Gardien Group is pleased to announce the installation of the Automated G90L Flying Probe Tester at Alpha Circuit Corp.
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
IEC confirms that the atg Luther & Maelzer A7Pro, eight-head, double-sided, high-speed flying probe test system has been ordered and installed at a prominent PCB manufacturer in Toronto, Canada.
In an interview at DesignCon, Gregory Miczek, global applications manager with RoBAT, discussed the company’s background and its expansion path from backplane defect analyzers to TDR testers for high-tech bare and assembled boards.