Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Rescheduled: iNEMI Roadmap Highlights Series: Organic PCB
April 24, 2020 | iNEMIEstimated reading time: 1 minute
iNEMI's Roadmap Highlights Series: Organic PCB Second session has been rescheduled to Friday, May 15, 2020 / 8:00 a.m. CST (China)
iNEMI is hosting a series of webinars highlighting information from our 2019 Roadmap. Leaders from the chapter working groups will present relevant market trends, key applications and other factors that are driving developments, plus current and future gaps that are impacting the industry.
The Organic PCB chapter addresses the technology needs for all forms of printed circuit boards and flexible circuits. This webinar will discuss the growing complexity of components that drive the need for multilayer PCB constructions. The continuing trends for higher speed processors, coupled with technology developments such as 5G communications, will be highlighted as these require specialized materials, in particular base laminates, as well as new fabrication techniques, such as mSAP, which will also be discussed. Considerations for dense packaging of electronics, including embedding passive and active components, are covered as well as optical PCB challenges. Advanced technologies used for organic semiconductor packaging substrates will also be included as their technologies are now being adapted for advanced high-density interconnect (HDI) PCBs.
This webinar is open to anyone; advanced registration is required.
Organic PCB Roadmap (Session 2)
Friday, May 15
8:00 a.m. CST (China)
5:00 p.m. PDT on Thursday, May 14 (Americas)
Register for this webinar
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).