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How New Metals Tariffs Impact the Electronics Industry

05/20/2026 | James Kim, Arentfox Schiff LLP
If you work in surface mount assembly, EMS, or anywhere along the electronics supply chain, you probably think of tariffs as something that happens upstream: raw materials, bulk commodities, maybe the occasional headache with Chinese imports. Steel and aluminum tariffs? That’s someone else’s problem. Not anymore. On April 2, President Trump signed a sweeping new proclamation that fundamentally restructures how Section 232 “national security” tariffs apply to steel, aluminum, copper, and their derivative products. The changes took effect on April 6, and the ripple effects are headed straight for the electronics industry.

Signal Integrity Meets Additive Innovation in the Latest Issue of I-Connect007 Magazine

05/18/2026 | I-Connect007 Editorial Team
Signal integrity and metallization are deeply intertwined, and this month’s I-Connect007 Magazine explores that convergence in detail. As Managing Editor Marcy LaRont explains, achieving electrical performance targets doesn’t stop at design; it depends heavily on how boards are fabricated, particularly through precise metallization processes.

Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/20/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

The 2027 Defense Deadline That is Forcing the U.S. to Rebuild 40 Years of Lost Tech

05/13/2026 | PRNewswire
Roughly 40 years ago, the United States made a decision that seemed perfectly rational at the time: it stopped processing rare earths.

I-Connect007 Releases The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication

05/15/2026 | I-Connect007
As PCB complexity continues to accelerate, fabricators and OEMs are reevaluating long-standing manufacturing processes to meet the demands of AI, HDI, advanced packaging, and next-generation electronics. To address these evolving challenges, I-Connect007 is proud to announce the release of The Printed Circuit Designer’s Guide to… Direct Metallization: A Guide to Complex PCB Fabrication, authored by MacDermid Alpha Solution’s Carmichael Gugliotti.
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