Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
May 19 Keysight Webinar: EM Circuit Co-Simulation and Analysis
April 30, 2020 | Keysight TechnologiesEstimated reading time: Less than a minute
As applications like 5G New Radio and automotive radars move toward mmWave frequencies, iterative EM circuit co-simulation is crucial for successful RF component designs. Discover the possibilities when using the latest EM circuit co-simulation technology for RFIC, modules, wafer-level-packaging, and RF PCBs.
This one-hour virtual seminar on May 19 will teach attendees how to automate the setup of EM circuits analysis of multi-technology components without layout modification or cookie cutting. EM results are seamlessly connected back to the circuit for spontaneous EM circuit co-simulation without the tedious and error-prone processing of separate EM analysis. You will also learn how to assemble and analyze multi-technology components to achieve design wins in this competitive market.
Date
Tuesday, May 19, 2020
Time
10:00 am PT / 1 pm ET
Presenters are Jack Sifri, MMIC/Module Flow Specialist, and How-Siang Yap, product manager of RF Circuit Synthesis EDA Tools, both with Keysight Technologies.
For more information or to register, click here.
Share on:
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).