- 
                                
                        
                         - News
 -  Books
                        
Featured Books
- design007 Magazine
 Latest Issues
Current Issue
                                                                                                        Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
                                                                                                        Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
                                                                                                        Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
 - Columns
 - Links
 - Media kit
 ||| MENU - design007 Magazine
 
May 19 Keysight Webinar: EM Circuit Co-Simulation and Analysis
April 30, 2020 | Keysight TechnologiesEstimated reading time: Less than a minute
As applications like 5G New Radio and automotive radars move toward mmWave frequencies, iterative EM circuit co-simulation is crucial for successful RF component designs. Discover the possibilities when using the latest EM circuit co-simulation technology for RFIC, modules, wafer-level-packaging, and RF PCBs.
This one-hour virtual seminar on May 19 will teach attendees how to automate the setup of EM circuits analysis of multi-technology components without layout modification or cookie cutting. EM results are seamlessly connected back to the circuit for spontaneous EM circuit co-simulation without the tedious and error-prone processing of separate EM analysis. You will also learn how to assemble and analyze multi-technology components to achieve design wins in this competitive market.
Date
Tuesday, May 19, 2020
Time
10:00 am PT / 1 pm ET
Presenters are Jack Sifri, MMIC/Module Flow Specialist, and How-Siang Yap, product manager of RF Circuit Synthesis EDA Tools, both with Keysight Technologies.
For more information or to register, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
KYZEN Honored with 2025 Step-by-Step Excellence Award for Its Innovative ANALYST² Process Control System
10/31/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is proud to announce that its ANALYST² Process Control System has won a 2025 Step-by-Step Excellence Award (SbSEA).
LPKF Delivers Key Strategic Technology to Fraunhofer's Glass Panel Technology Group
10/29/2025 | LPKFLPKF Laser & Electronics SE is one of the initiators of the Glass Panel Technology Group (GPTG), a consortium encompassing the entire process chain for advanced semiconductor packaging with glass substrates.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.