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Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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DownStream Webinar May 6: PCB Documentation Tips
April 30, 2020 | DownStream TechnologiesEstimated reading time: Less than a minute
Current tools and methodologies for PCB documentation are essentially workarounds that, rather than automating, in fact create obstacles to quickly producing detailed and accurate PCB documentation.
What is needed is a new approach to PCB documentation—a standalone PCB document authoring tool, developed in the style of Microsoft Office, which quickly creates electronic drawings to drive the PCB fabrication and assembly processes; a tool that “knows” it is creating a PCB document and leverages the PCB CAD data to automatically create and intelligently link PCB views, details, document notes, external documents, URLs and multimedia content.
Attendees will learn how to use BluePrint for Circuit Boards to take control of their documents through automation, while enhancing detail, accuracy, and instructions. High-quality PCB documentation leads to fewer questions, fewer errors, lower overall costs, and huge time savings.
This webinar takes place twice on Wednesday, May 6, 2020.
9 am Eastern Time (6 am Pacific Time) Click here to register.
2 pm Eastern Time (11 am Pacific Time) Click here to register.
Suggested Items
Smart Automation: The Growing Role of Additive Manufacturing
04/23/2025 | Josh Casper -- Column: Smart AutomationAs additive manufacturing (AM) matures and reaches new business sectors throughout the manufacturing world, electronics manufacturing is beginning to reap the benefits of this ultra-flexible technology. AM (also known as 3D printing) capabilities have now expanded to support a wide range of applications in the electronics industry. The development of materials in additive manufacturing is meeting the demands of high-temperature environments and ESD protection necessary to become a viable solution in electronics manufacturing.
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
04/17/2025 | Matt Stevenson -- Column: Connect the DotsIf you have read any of my earlier columns, you know I am passionate about helping designers design for the reality of manufacturing. Designing for manufacturability (DFM) is a team sport. DFM is a design process that looks forward to the manufacturing process and integrates with it so that manufacturing requirements and capabilities can be accurately reflected in the design work.
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
03/31/2025 | PRNewswireThe growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
Würth Elektronik Presents its ICLED Color Calculator
03/20/2025 | Wurth ElektronikWürth Elektronik presents ICLED Color Calculator – a new service on its REDEXPERT online platform. This unique, free tool allows developers to quickly and accurately determine the exact PWM values needed to achieve specific ICLED color values, without requiring additional measurements.
Calling All Designers: The Latest Design Technology and AI
03/20/2025 | Andy Shaughnessy, Design007 MagazineAdvanced design technology and AI were in the spotlight at the annual Design Town Hall, held March 19 during IPC APEX EXPO 2025. Speakers included IPC’s Peter Tranitz, Matt Kelly, Devan Iyer, as well as a panel on the use of AI in PCB design moderated by Susan Kayesar of Siemens.