The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Zuken On-demand Webinar: MCAD Integration for Wire Harness Design
May 4, 2020 | ZukenEstimated reading time: Less than a minute
Do you need to move data back and forth between your MCAD and harness design tools and processes? Design processes that span multiple tool domains require design data to move from one domain to the other to resolve and verify design elements. But, moving data between the two domains can be problematic. This on-demand webinar will look at the challenges and solutions for bridging MCAD and wire harness design.
Zuken's E3.3DTransformer has the capability to import 3D-based M-CAD models from various authoring systems like Dassault Systems CATIA, Siemens NX or native, open-standardized 3D exchange formats like JT and extract electrical, harness-related topological information for re-use in subsequent harness engineering processes and tools. Along with a wide variety of formats supported E3.3DTransformer features a simplification and healing functionality for extracted harness topology structure like the reduction of obsolete vertices or join of not-coherent segments. With an easy to use UI and short setup time, you could be on your way to a quicker and money-saving design process.
To register for this on-demand webinar, click here.
Share on:
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
If You Can Define It Right, You Can Design It Right
12/05/2024 | Andy Shaughnessy, Design007Design engineer Chris Young is known for his optimized design process. As lead hardware engineer with Moog Space and Defense Group and owner of Young Engineering Services, Chris collects data like it’s going out of style, and he leaves nothing to chance. With that in mind, I asked Chris to discuss his views on rules of thumb—which ones work, which ones should be avoided, and how rules fit ideally into the PCB design process.