Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Zuken On-demand Webinar: MCAD Integration for Wire Harness Design
May 4, 2020 | ZukenEstimated reading time: Less than a minute
Do you need to move data back and forth between your MCAD and harness design tools and processes? Design processes that span multiple tool domains require design data to move from one domain to the other to resolve and verify design elements. But, moving data between the two domains can be problematic. This on-demand webinar will look at the challenges and solutions for bridging MCAD and wire harness design.
Zuken's E3.3DTransformer has the capability to import 3D-based M-CAD models from various authoring systems like Dassault Systems CATIA, Siemens NX or native, open-standardized 3D exchange formats like JT and extract electrical, harness-related topological information for re-use in subsequent harness engineering processes and tools. Along with a wide variety of formats supported E3.3DTransformer features a simplification and healing functionality for extracted harness topology structure like the reduction of obsolete vertices or join of not-coherent segments. With an easy to use UI and short setup time, you could be on your way to a quicker and money-saving design process.
To register for this on-demand webinar, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/09/2025 | Andy Shaughnessy, Design007 MagazineTrade show season is wrapping up as we head into summer. Where has the time gone? I hope you all get the chance to take a vacation this year, because I know you’ve earned one. Speaking of which, when was my last vacay? If I can’t remember, it’s probably time for one. It’s been a busy week in electronics, with fallout from the back-and-forth on tariffs taking up most of the oxygen in the room. We have quite an assortment of articles and columns for you in this installment of Must-Reads. See you next time.
Imec Coordinates EU Chips Design Platform
05/09/2025 | ImecA consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.