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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Zuken On-demand Webinar: MCAD Integration for Wire Harness Design
May 4, 2020 | ZukenEstimated reading time: Less than a minute
Do you need to move data back and forth between your MCAD and harness design tools and processes? Design processes that span multiple tool domains require design data to move from one domain to the other to resolve and verify design elements. But, moving data between the two domains can be problematic. This on-demand webinar will look at the challenges and solutions for bridging MCAD and wire harness design.
Zuken's E3.3DTransformer has the capability to import 3D-based M-CAD models from various authoring systems like Dassault Systems CATIA, Siemens NX or native, open-standardized 3D exchange formats like JT and extract electrical, harness-related topological information for re-use in subsequent harness engineering processes and tools. Along with a wide variety of formats supported E3.3DTransformer features a simplification and healing functionality for extracted harness topology structure like the reduction of obsolete vertices or join of not-coherent segments. With an easy to use UI and short setup time, you could be on your way to a quicker and money-saving design process.
To register for this on-demand webinar, click here.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.