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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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TTM Technologies, Inc. Announces Upcoming Conference Participation
May 7, 2020 | GlobeNewswireEstimated reading time: 1 minute
TTM Technologies, Inc., a leading global printed circuit board (PCB) and radio frequency (RF) components manufacturer, today announced that members of its management team will virtually present at the following investor conferences:
- The J.P. Morgan Technology, Media, and Communications Conference on May 12th, 2020 at 4:10pm Eastern Time
- The Needham Technology and Media Conference May 19th, 2020 at 1:45pm Eastern Time
- The Baird Global Consumer, Technology and Services Conference on June 3th, 2020 at 3:10pm Eastern Time
- The Stifel Cross Sector Insight Conference on June 9th. After our presentation time has been finalized, we will post this event to our website
All presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.
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Julia McCaffrey - NCAB GroupSuggested Items
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
What Heterogeneous Integration Means for EMS Providers
05/14/2026 | Nolan Johnson, I-Connect007Dr. Ravi Mahajan, an Intel Fellow and Director of Intel’s Technology and Pathfinding group, delivered a keynote at the APEX EXPO 2026 technical conference on using heterogeneous integration (HI) as a strategy and on how advanced packaging technology serves as the technical apex for implementing that strategy. Mahajan’s previous papers and industry presentations on such topics as interconnect density, signal integrity, power delivery, thermal path, and assembly yield as system-level constraints confirm him as an expert on package optimization.
Zhen Ding Reports Record 1Q26 Revenue; Up 1.6% YoY
05/14/2026 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced its consolidated financial results for the first quarter of 2026. First quarter revenue reached NT$40,728 million, up 1.6% YoY and setting a record high for the same period. Net income was NT$2,047 million, and net income attributable to the parent company was NT$1,426 million, with EPS of NT$1.33.
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.
HFR Accelerates GPU-Based AI-RAN Development with ETRI
05/11/2026 | PRNewswireHFR, Inc., a leading telecommunications equipment provider, announced that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.