Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
HDP User Group Hosts Free Automotive Electronics Webinar
May 27, 2020 | PRWEBEstimated reading time: 1 minute
High-Density Packaging (HDP) User Group is pleased to announce it is hosting a webinar that will provide its members and others in the electronic industry the latest information on standard requirements and developments in automotive electronics.
“Automotive Electronics is one of the fastest-growing segments of advanced electronics technology. We have planned an informational session that will cover the latest developments in automotive standards and automotive electronic packaging”, said Marshall Andrews, Executive Director of HDP User Group.
The Webinar will be held on June 25, 2020, at 8 AM USA Central Time.
Agenda 8:00 AM – 11:00 AM US Central Time
Welcome – Larry Marcanti, HDP
Opening of the Webinar by the Moderator
Jan Vardeman, President, and Founder of Techsearch International recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.
Mobility Trends and Their Impact on The Automotive Supply Chain
- ZVEI – DR Stefan.Gutschling
Power PCB requirements for Automotive Applications
- Ventec Laminates – Alun Morgan
Automotive Packaging Trends – Challenges & Solutions
- Infineon – Thorsten Meyer
The regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market.
- UL – Art Creidler
Considerations in Automotive PCB manufacture
- TTM – Raj Kumar
Round Table & Questions
- Webinar Close
The Webinar is in the English language.
Please register for webinar log-in and call details by emailing your contact info (name, Company Info, Email) to one the following people:
kima77@hdpug.org, martinc@hdpug.org, or larrym@hdpug.org
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Kris Moyer Discusses His Emerging Design Technologies Class
09/04/2025 | Marcy LaRont, I-Connect007Kris Moyer, a design instructor for the Global Electronics Association, will be teaching his advanced PCB design class this fall. If you’re ready to level up your design education, you won’t want to miss this interview. The PCB Design for Emerging Design Technologies course is designed to provide the skills necessary to create PCB/PBA designs that require cutting-edge emerging design technologies and comply with all necessary IPC standards, including new standards being developed in this area.
NOTE Appoints Bahare Mackinovski Chief Sales and Marketing Officer
09/04/2025 | NOTEAs part of NOTE’s strategic focus on growth and customer value, the company is now strengthening its executive management team by appointing Bahare Mackinovski as Chief Sales and Marketing Officer.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.