-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Pasternack Launches Seven New Fixed Load VNA Calibration Kits
June 1, 2020 | PasternackEstimated reading time: 1 minute

Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has just released a new line of short-open-load-through (SOLT) calibration kits that are ideal for use in test and measurement, lab and RF & Microwave production test applications.
Pasternack’s expanded line of VNA calibration kits are available in 12 versions including short circuit, open circuit and load kits (SOL) as well as short circuit, open circuit, load and thru kits (SOLT) with 2.4mm, 2.92mm, 3.5mm, 7/16 DIN, 7mm, BNC and N-Type interface options.
Each of these new VNA calibration kits from Pasternack include all of the necessary short circuit, open circuit, loads and thru (model dependent) components required for VNA calibration. The kits are suitable for many vector network analyzers from the industry’s leading providers such as Agilent, Rohde & Schwarz, Anritsu and Copper Mountain. These RF test and measurement kits come packaged in protective wooden boxes.
The new SOLT calibration kits offer excellent performance characteristics that are specially designed for the fine-tuning and calibration of sensitive test equipment in engineering labs, production environments and quality testing facilities. Every Pasternack calibration kit is built to withstand years of rigorous use and provides accurate RF equipment calibration for the life of the product.
“A properly calibrated VNA is required for precise characterization of RF and microwave components used in a myriad of industries and applications. These new SOLT calibration kits provide the precision components that are essential to perform accurate analyzer calibrations,” said Steve Ellis, Interconnect Product Line Manager at Pasternack.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.