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Embedded Design: Materials Matter

02/27/2024 | John Andresakis, Quantic Ohmega-Ticer
The rapid advance of mobile technologies has sparked an insatiable demand for radio spectrum bandwidth. The rush to capitalize on wider bandwidths, higher data rates, and lower latency offered by frequency bands like 5G and millimeter wave is evident across industries. Cellular 5G and 6G networks, low-Earth orbit (LEO) and mid-Earth orbit (MEO) satellites, interconnected devices (IoT), autonomous vehicles, and even defense and environmental monitoring systems are driving this paradigm shift.

Open Platforming, AI and Strategic Cement Schneider Electric’s Leadership in End-to-end Solutions

02/27/2024 | Schneider Electric
Schneider Electric, the leader in the digital transformation of energy management and automation, announced the latest innovations and progress towards accelerating grid modernization at DISTRIBUTECH International® 2024, the leading annual transmission and distribution event for utilities, technology providers, and industry leaders. Schneider has also affirmed their leadership in distributed energy resources management with its recognition by Guidehouse Insights as a leader in 2024 for both Grid DERMs and Grid Edge DERMS and #1 in 2023 for ADMS, reinforcing its strength with an industry-leading end-to-end portfolio and ecosystem for grid modernization.

IPC White Paper Emphasizes Critical Importance of Data Analytics for Electronics Manufacturing Process

02/26/2024 | IPC
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist Council (CTC), "Outlook for Data Analytics in the Electronics Manufacturing Industry."

IPS Engineers on AI and More

02/26/2024 | Barry Matties, I-Connect007
Over the past few months, we have met several of IPS's team members. IPS has been a manufacturer of wet process equipment for printed circuit board fabrication for over 30 years, working from its Cedar City, Utah, location. In part one of this interview, you will meet IPS team members Travis Houchin, Larry Boehm, and Kaal Glazier. With this group of two seasoned industry experts and the voice of the next generation, we cover several topics, including AI, and some useful tips when considering equipment, especially in brownfield sites.

TECHNICAL PAPER: Novel Automatic Repair of Populated PCBs in a Cost-effective and Adaptive Way

02/21/2024 | Essemtec, a NanoDimension Division
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
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