-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Project HiperLAM Delivers Outstanding Results Using PV Nano Cell’s Sicrys Ink
June 17, 2020 | PV Nano CellEstimated reading time: 1 minute
PV Nano Cell Ltd, an innovative provider of inkjet-based conductive digital printing solutions and producer of conductive digital inks, announced that its Sicrys™ ink was successfully used to deliver exceptional results in HiperLAM—a European Union-funded program to laser print RFID antennas and fingerprint sensors.
The HiperLAM project is focused on demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing. Two key applications requiring high resolution printed conductive metallic lines are studied. Laser printed RFID antennas and laser printed fingerprint sensors. The project received funding from the European Union's Horizon 2020 Research and Innovation Program under Grant Agreement No. 723879.
PV Nano Cell’s Chief Executive Officer, Dr. Fernando de la Vega, commented, “We are happy to yet again join hands with some of the leading researchers and commercial companies in the world to develop new digital additive manufacturing technologies. This time we focus on LIFT – Laser Induced Forward Transfer technology. This technology enables printing in both solid and liquid phase, down to 10 µm in resolution, a variety of materials are supported and no use of nozzles. We provided our specially designed ink to accommodate the unique needs of the technology and I'm happy to share the results were very impressive. The lines width achieved is around 90 µm and the pitch is around 20 µm. The printed samples are of excellent quality, with low resistance and suitable for high frequency band applications.”
One of the leading partners in this program is NTUA - National Technical University of Athens. Professor Ioanna Zergioti from the School of Applied Mathematics and Physical Sciences commented, “Our collaboration with PV Nano Cell (PVN) resulted in new scientific results but also in new products. This combination is very difficult to achieve and we thank the team from PVN for their contribution to deliver high quality work and producing new inks for the digital printing process.”
PV Nano Cell’s Chief of Business Development Officer, Mr. Hanan Markovich commented, “Demonstrating commercial capabilities of the LIFT technology is of high importance to PV Nano Cell as we develop additional additive manufacturing products for conductive printing. We believe there is great potential in using lasers to print and that this technology is complementary to inkjet printing. We've already started to formulate new partnerships in this area and look forward to growing the business with yet another, new and exciting potential growth engine.”
Suggested Items
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.