- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the WeekJune 19, 2020 | Andy Shaughnessy, Design007 Magazine
Estimated reading time: 2 minutes
In industry news this week, there are plenty of hopeful signs as the world begins to emerge from what seems like a long, cold winter. I was surprised to learn just how much M&A activity had taken place over the last year in the EMS segment, even during less-than-optimum times. Once again, this industry has proven to be very resilient. Check it out.
This week’s five items were sourced from all I-Connect007’s various news sources and publications, including Design007, PCB007, SMT007, The Daily Newsletter, and our weekly newsletters for SMT007, Design007, and MilAero007. Next week, Nolan Johnson will make his selections.
by Rick Hartley
Published June 11, 2020
We recently interviewed instructors Rick Hartley and Dan Beeker for a feature in the June 2020 issue of Design007 Magazine that focused on app notes. After the issue was published, Rick reached out to us with a letter to the editor, explaining a few more points that he wanted to make. Among them: “Simply put, app engineers do not understand how PCBs work.” The app notes issue continues to be, well, an issue.
by Tom Kastner
Published June 15, 2020
It may seem like we’ve been stuck in some kind of alternate reality for the past four months, but business is continuing, and deals are being made—constantly. In his latest column, Tom Kastner discusses the 20 EMS mergers and acquisitions that have been inked in the last year. Even the COVID-19 lockdown couldn’t stop this industry’s M&A activity.
by Sunstone Circuits
Published June 18, 2020
Some companies in our industry have dialed back their plans for the remainder of 2020, but Sunstone Circuits has been busy investing in new equipment. The Oregon-based fabricator has recently installed a HASL machine, a flying probe electrical tester, and a high-speed drill system. Is your company planning to upgrade its equipment, processes, and systems?
by Sagi Reuven
Published June 17, 2020
In his first SMT007 column, Sagi Reuven of Siemens Digital Industries explains why true ROI begins with smart data. We’re surrounded by more and more data every day, but as Sagi says, “It’s not just about collecting data: it’s about making the data smart.” Check back to read Sagi’s columns, which he plans to use as a “sandbox” for brainstorming.
DownStream Technologies Update With Joe Clark
by Andy Shaughnessy
Published June 17, 2020
In this audio interview, Joe Clark, co-founder of DownStream Technologies, explains how the company continued operating during the pandemic, as well as its plans to move forward in the coming months as the U.S. and the rest of the world begins to reopen. He also discusses DownStream’s drive to present training webinars as the industry gets back on track. I think it’s safe to say that webinars are going to continue to grow in popularity in our industry, even when things get back to “normal.” It's nice to see shows like PCB West and SMTA International scheduled to take place this fall.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.