-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Book Excerpt: Signal Integrity by Example, Chapter 3
June 24, 2020 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
The following is an excerpt from The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.
Chapter 3: Crosstalk
Root Cause
Crosstalk is another major issue to investigate during signal integrity analysis of a design. Typically, a third of the design’s noise budget is allocated to noise coming from crosstalk. In order to solve crosstalk issues, it is very important to understand the root cause. Coupling between two transmission lines occurs due to fringe electric fields and magnetic fields. When a signal propagates on a transmission line, it will generate fields as shown in Figure 3-1.
The E-fields, in blue, are lines emanating from the signal and return paths on which the signal is propagating and couples to all surrounding metal. That E-field will induce a voltage on any conductors lying inside the field. Similarly, the signal will also generate H-fields that will induce currents on the surrounding metal.
The coupling mechanism can also be described using mutual inductances and capacitances. A signal return path loop has a loop inductance. Any two loops in close proximity will have a loop mutual inductance between them. A signal carrying a time-varying current, di/dt, will couple from one loop to the other through this mutual inductance. Also, the same signal will have a time-varying voltage, dV/dt, and that will capacitively couple to neighboring traces.
Based on this, it is important to keep in mind that as a signal propagates down a trace, the coupling takes place at the location of the transitioning edge, where the dV/dt and the dI/dt are. As a signal propagates, the edge will have a spatial extent along the interconnect. Whether it is a falling or a rising edge, the time varying fields exist where that edge is. The steady state part of the signal does not contribute to coupling since it contains no time varying voltages or currents.
It is very important to mention that once a signal couples onto a trace as noise, the noise will split and propagate in both directions as shown in Figure 3-2.
To download the eBook The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business, click here.
To visit the I-Connect007 library and check out the entire lineup of free eBooks, click here.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.