-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Book Excerpt: Signal Integrity by Example, Chapter 3
June 24, 2020 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

The following is an excerpt from The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.
Chapter 3: Crosstalk
Root Cause
Crosstalk is another major issue to investigate during signal integrity analysis of a design. Typically, a third of the design’s noise budget is allocated to noise coming from crosstalk. In order to solve crosstalk issues, it is very important to understand the root cause. Coupling between two transmission lines occurs due to fringe electric fields and magnetic fields. When a signal propagates on a transmission line, it will generate fields as shown in Figure 3-1.
The E-fields, in blue, are lines emanating from the signal and return paths on which the signal is propagating and couples to all surrounding metal. That E-field will induce a voltage on any conductors lying inside the field. Similarly, the signal will also generate H-fields that will induce currents on the surrounding metal.
The coupling mechanism can also be described using mutual inductances and capacitances. A signal return path loop has a loop inductance. Any two loops in close proximity will have a loop mutual inductance between them. A signal carrying a time-varying current, di/dt, will couple from one loop to the other through this mutual inductance. Also, the same signal will have a time-varying voltage, dV/dt, and that will capacitively couple to neighboring traces.
Based on this, it is important to keep in mind that as a signal propagates down a trace, the coupling takes place at the location of the transitioning edge, where the dV/dt and the dI/dt are. As a signal propagates, the edge will have a spatial extent along the interconnect. Whether it is a falling or a rising edge, the time varying fields exist where that edge is. The steady state part of the signal does not contribute to coupling since it contains no time varying voltages or currents.
It is very important to mention that once a signal couples onto a trace as noise, the noise will split and propagate in both directions as shown in Figure 3-2.
To download the eBook The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business, click here.
To visit the I-Connect007 library and check out the entire lineup of free eBooks, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.