The Shaughnessy Report: A Stack of Advanced Packaging Info
Connect the Dots: Designing for Reality: Strip-Etch-Strip
Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
IPC and High Density Package Users Group Strengthen Collaboration with MoU
June 24, 2020 | IPCEstimated reading time: 1 minute
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
“Both IPC and HDP are member-driven organizations,” said Matt Kelly, IPC chief technologist. “Working together, both organizations will focus on next generation HDI technology projects to benefit the electronics manufacturing industry. HDP is very well established with more than 25 years of experience in R&D technology development. Resultant, new HDI learning and solutions will help drive IPC standards development activities as well as training and education programs.”
IPC and HDP have successfully worked together for many years on such electronics industry issues as electrochemical migration, high density ball grid arrays, board thickness on solder joint reliability and members of HDP have presented papers at IPC APEX EXPO on high frequency loss test methods for laminate materials and smooth copper signal integrity.
“A closer working relationship between IPC and HDP will bring significant advantages to both organizations, and as a result, to the industry,” noted Marshall Andrews, executive director of HDP. “Electronics manufacturing technology is moving faster than ever with the introduction of 5G and automotive applications. Close cooperation at all levels of the supply chain will be necessary to address issues and implement the new materials and processes required to keep moving forward. IPC and HDP will help make those changes smooth and reliable.”
Share on:
Suggested Items
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.
ViTrox Expands Midwest Reach with ASC International as New Sales Channel Partner
12/09/2024 | SMTAViTrox Americas Inc. is pleased to announce ASC International as its new Sales Channel Partner and Manufacturers’ Representative for Minnesota, North Dakota and South Dakota.
ASMPT: Innovative Bonding for Power Electronics
12/09/2024 | ASMPTASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
Nolan’s Notes: Soldering Technologies
12/03/2024 | Nolan Johnson -- Column: Nolan's NotesThere are schools of thought that soldering methods are similarly anachronistic but still useful enough not to be worth changing. While that may be true, I see that soldering technologies are experiencing significant changes. It might not be apparent on the surface, but changes are afoot, and there are some disruptive things underway as well.