Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
IPC and High Density Package Users Group Strengthen Collaboration with MoU
June 24, 2020 | IPCEstimated reading time: 1 minute
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
“Both IPC and HDP are member-driven organizations,” said Matt Kelly, IPC chief technologist. “Working together, both organizations will focus on next generation HDI technology projects to benefit the electronics manufacturing industry. HDP is very well established with more than 25 years of experience in R&D technology development. Resultant, new HDI learning and solutions will help drive IPC standards development activities as well as training and education programs.”
IPC and HDP have successfully worked together for many years on such electronics industry issues as electrochemical migration, high density ball grid arrays, board thickness on solder joint reliability and members of HDP have presented papers at IPC APEX EXPO on high frequency loss test methods for laminate materials and smooth copper signal integrity.
“A closer working relationship between IPC and HDP will bring significant advantages to both organizations, and as a result, to the industry,” noted Marshall Andrews, executive director of HDP. “Electronics manufacturing technology is moving faster than ever with the introduction of 5G and automotive applications. Close cooperation at all levels of the supply chain will be necessary to address issues and implement the new materials and processes required to keep moving forward. IPC and HDP will help make those changes smooth and reliable.”
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.