-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Enhanced System-level Engineering and Physical Design Efficiency in CR-8000 2020
July 1, 2020 | ZukenEstimated reading time: 1 minute

Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable contributions from academic research institutions such as UCLA or Fraunhofer IIS have also been incorporated into the release, particularly in the field of advanced packaging.
Key development themes for CR-8000 2020 were superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
- Design efficiency benefits from significant enhancements in the areas of schematic design, FPGA optimization, skew group routing and support of back-drilled vias.
- System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and ANSYS.
- The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.
“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base”, says Kazuhiro Kariya, Managing Director of Zuken Inc., Yokohama. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of 3rd party design tools that are reaching their limits.”
The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs. Many legacy design tools are facing growing limitations, both in terms of system-level design and technology support.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Kodiak Assembly Solutions Renews ITAR Registration, Providing Secure and Compliant Manufacturing for Defense & Aerospace
09/25/2025 | Kodiak Assembly SolutionsKodiak Assembly Solutions LLLP, a leading electronics contract manufacturer, has successfully renewed its ITAR (International Traffic in Arms Regulations) registration.
Cyient DLM, A Voice from the Frontlines
09/24/2025 | Arpita Das, Global Electronics AssociationOnce seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.
Nortech Systems Achieves Enhanced Fiber Optic Performance
09/16/2025 | Nortech SystemsNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced significant advancements in its fiber optic capabilities.
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.