Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
Elementary, Mr. Watson: Rules of Thumb—Guidelines vs. Principles for PCB Design
Beyond Design: High-speed Rules of Thumb
Enhanced System-level Engineering and Physical Design Efficiency in CR-8000 2020
July 1, 2020 | ZukenEstimated reading time: 1 minute
Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable contributions from academic research institutions such as UCLA or Fraunhofer IIS have also been incorporated into the release, particularly in the field of advanced packaging.
Key development themes for CR-8000 2020 were superior design efficiency, comprehensive system-level design and verification, and support for the latest advancements in packaging technology.
- Design efficiency benefits from significant enhancements in the areas of schematic design, FPGA optimization, skew group routing and support of back-drilled vias.
- System-level design and verification have been enhanced in the areas of electro-mechanical co-design of flex-rigid PCBs and multi-domain analysis through direct integration of best-in-class solutions from Zuken’s partners, Keysight and ANSYS.
- The latest advancements in packaging technology are supported by new functionality for tile bump and 3D wire design planning.
“Our global development teams in Japan, USA, and Europe have been working very hard to evolve the capabilities of CR-8000, our flagship EDA design tool suite, to stay on top of the exacting requirements of our global blue-chip customer base”, says Kazuhiro Kariya, Managing Director of Zuken Inc., Yokohama. “While our users will benefit from significant efficiency enhancements in the areas of engineering productivity and process resilience, we have also dedicated our attention to enabling a smooth transition for new customers who are locked into of 3rd party design tools that are reaching their limits.”
The CR-8000 platform is built upon the latest software methodologies and utilizes hardware acceleration to provide the needed performance for today’s complex and multi-discipline designs. Many legacy design tools are facing growing limitations, both in terms of system-level design and technology support.
Share on:
Suggested Items
Case Study: PCB Design Flaws Affect Product Cost
12/03/2024 | Matt Stevenson, ASC SunstoneIn the rapidly evolving aerospace industry, precision and reliability are paramount. “AeroTech Solutions” (not the company’s real name), an aerospace company specializing in satellite technology, recently faced a significant challenge that tested its operational integrity: A flaw identified in the PCB design of its latest satellite model led to unexpected delays and cost overruns.
VORAGO Technologies, Collabora Partner to Advance Open Source in Space
11/25/2024 | GlobeNewswireVORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
AirBorn Announces Agreement to be Acquired by Molex
11/18/2024 | PRNewswireAirBorn, a global manufacturer of high reliability electronics and components, announced it has entered into an agreement to be acquired by Molex, a leading global connectivity and electronics solutions provider.
RTX's Collins Aerospace to Provide UK Chinook Helicopters with Interoperable Avionics System
11/12/2024 | RTXCollins Aerospace, an RTX business, has received a $19 million contract from the Department of Defense to equip a fleet of new H-47 Chinooks for the UK Royal Air Force with its Common Avionics Architecture System (CAAS) avionics management suite.