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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Mentor Webinar: Ensuring DDR4 Electrical Performance at Intended Data RatesJuly 2, 2020 | Mentor, a Siemens business
Estimated reading time: Less than a minute
DDR interfaces have many signal integrity and timing requirements that must be guaranteed between multiple signal groups. Conformance to the requirements should be verified before a board is fabricated to reduce the chance of prototype spins. Traditionally, designers have relied on dedicated SI experts to perform this task, or laid out boards based on manufacturer’s guidelines and skipped post-route verification entirely, hoping to avoid problems in the lab. Increasing data rates have pushed DDR operating margins to the point where simply following physical design rules is no longer enough to ensure that a design will work as intended.
This on-demand webinar will discuss the different electrical requirements associated with DDR designs and show how board and system designers can use HyperLynx to perform post-route verification themselves, helping free up scarce SI experts to focus on their company’s most challenging analysis problems.
The webinar is presented by Min Maung, a senior technical marketing engineer for HyperLynx Analysis Tools Suite for the Electronic Board Systems segment at Mentor, a Siemens Business.
To view this on-demand webinar, or for more information, click here.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.