-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
ON Semiconductor to Provide Danfoss with High Power Devices for Inverter Traction Modules
July 6, 2020 | Business WireEstimated reading time: 1 minute
ON Semiconductor, driving energy efficient innovations, and Danfoss A/S announced that ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the fast growing electric vehicle market.
As a leading supplier of power semiconductors for more than 50 years, ON Semiconductor has developed a wide range of automotive components, by applying advanced technology and extensive R&D expertise, in the fields of high-voltage interfacing, smart power management, in-vehicle networking, system level integration, and sensor interfaces. The company also provides a robust set of modeling tools that enable the designer to realize application performance in simulation rather than costly measurement cycles. In addition, utilizing the 12 inch Fab in East Fishkill, ON Semiconductor is perfectly positioned to supply competitive devices at a scale necessary to serve the vehicle electrification market for years to come.
Danfoss Silicon Power is a subsidiary of the Danfoss Group, the largest industrial company in Denmark. For decades, Danfoss Silicon Power has been helping top tier manufacturers and system suppliers meet stringent reliability, design and cost targets by designing, developing and manufacturing customized power modules for automotive, industrial and renewable applications.
“Chip independency is an important and fundamental element of the Danfoss go-to market strategy. By selecting IGBT chips from ON Semiconductor we are accommodating the high growth expectations from our automotive customers,” said Claus A. Petersen, senior vice president and general manager, Danfoss Silicon Power. “Our main objective is to develop world-class power modules, fitted exactly for the application in question. We are happy to have a long-term and robust relationship with ON Semiconductor.”
“With investment in power technologies and manufacturing capacity globally, ON Semiconductor reiterates our firm commitment to be the top supplier of automotive high power devices,” said Asif Jakwani, senior vice president of the Advance Power Division at ON Semiconductor. “Utilizing our semiconductor portfolio with Danfoss’ extensive experience in power module design and manufacturing, we expect our penetration in the vehicle electrification market to accelerate, benefitting both companies.”
ON Semiconductor will fabricate the high-power components in manufacturing locations in East Fishkill, New York, and Bucheon, South Korea. Danfoss will fabricate their power modules in Flensburg, Germany, and Utica, New York.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.