Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
AltiumLive 2020 Goes 'Virtual'
July 6, 2020 | AltiumEstimated reading time: 2 minutes
Like most events in 2020, Altium is transitioning its annual flagship conference, AltiumLive, to an online experience this year. Altium will host its North American event from October 6-8, and the European event from October 20-22, 2020. Both events are free to attend.
While nothing can duplicate the experience of a live event or being physically together, Altium is busy planning ways to deliver its unique AltiumLive experience in the first-ever AltiumLive 2020 Virtual Summit. As always, Altium will provide a dynamic approach to Learn, Connect, and Get Inspired in the convenience of your home or workplace. Making the conference both virtual and free of cost should remove the limits of time, travel, workload, and budget, enabling many more users and members of the design community to attend.
Altium will be sharing more details in the weeks ahead. Here is a small glimpse of what you can expect from the first-ever AltiumLive Virtual Summit.
Learn
Is AltiumLive “Live?” Yes, and it’s on-demand too. As usual, Altium will be featuring some of the industry’s top experts to present live sessions. Attendees will also have the opportunity to ask questions and participate in a live chat following each session.
In addition to eight live presentations, Altium will also offer many pre-recorded (original) sessions that you can watch in a timeframe that works best for you. This includes courses from Altium staff, fellow Altium Design engineers, and supply chain experts.
Keeping with tradition, Altium will also be sharing a (pre-release) live demonstration of Altium Designer 21.
Connect
AltiumLive Virtual Summit will provide attendees with multiple opportunities to network with fellow engineers, Altium staff, and sponsors who will share insights from crucial areas of the supply chain. There will also be a few surprises along the way, so stay connected. Please look for the latest news and updates via email and on all our social media channels, including upcoming registration information.
Get Inspired
The company will be sharing some Altium Stories from talented design engineers from within the Altium Community who will inspire you with fresh ideas and leave you excited about the work you do every day. Attendees will also find inspiration from thought leaders, your peers, and connections made with members of the Altium team.
Your “Customized” AltiumLive Experience
A virtual event is not the same as a live event, but there is a unique opportunity for attendees to customize their AltiumLive experiences. In the wake of the global pandemic, the modern workplace is evolving and Altium will meet you where you are in 2020. For instance, the “live” presentations will take place over three days, in half-day segments, which will allow attendees to get the most out of AltiumLive while still remaining productive with your day-to-day roles and responsibilities. The remainder of the sessions and activities are optional and can be enjoyed at each attendee’s convenience.
Save The Date
Mark your calendars now:
AltiumLive North America: October 6-8, 2020
AltiumLive Europe: October 20-22, 2020
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.