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Rogers Corporation's Advanced Connectivity Solutions Business Adds North America Distribution ChannelJuly 7, 2020 | Rogers Corporation
Estimated reading time: 1 minute
Rogers Corporation’s Advanced Connectivity Solutions (ACS) business announced the introduction of a new distribution channel in North America with the addition of Bonding Source, a Krayden Company, to their sales and service team effective July 6, 2020. ACS provides global customers with market-leading high performance and high reliability RF material solutions.
Bonding Source has built a reputation as a global source for Microelectronics and RF/ Microwave materials servicing Defense, Satellite, Aerospace, and a range of electronics markets. Bonding Source differentiates itself by working with customers to forecast needs and stocks material to offer immediate delivery with no minimum quantities, excellent customer service and unparalleled technical support. The Bonding Source Engineering team provides significant support in preform design, layout optimization and quick turn on laser cut preforms.
Rogers and Bonding Source, working closely as a team, will provide both sales and onsite service/support to both OEM and PCB manufacturing customers throughout North America.
Bonding Source General Manager Jim Wise commented, “We are excited to be working with Rogers Corporation and their Thermally and Electrically Conductive Adhesive (TECA) product line. COOLSPAN® film is leading edge and allows our customers to excel in producing high performance PCB solutions. The Bonding Source team will provide market leading service and support to ensure our customers success.”
Ron Bader, Rogers Director of Sales for North America, noted, “I am pleased Bonding Source and Rogers were able to form this relationship that focuses on enhancing our ability to service our customers in North America through improved quick turn service and local support.”
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable the company’s growth drivers-- advanced connectivity and advanced mobility applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
Further to the announcement of 17 August 2023, BAE Systems has now received the necessary regulatory approvals and will be executing steps in the coming days to complete the acquisition of Ball Aerospace from Ball Corporation.
With such an extremely newsy week, it was hard to select just five items you absolutely must read, but here goes. We have advocacy news from PCBAA and IPC, global market data on AI PC and GenAI smartphone hardware, a roundtable discussion on sales and marketing, a bookended pair of international milaero stories emphasizing a healthy aerospace industry, and an industry report on global semiconductor sales.
Honeywell announced it will invest $84 million to expand its Olathe manufacturing facility in Kansas. The project, which is expected to generate nearly $47 million in total gross domestic product (GDP) and contribute $18.3 million to state and local taxes in the first six years, supports the company's alignment with the compelling megatrend of the future of aviation.
Ventec International Group Co., Ltd. is pleased to announce that its VT-901 polyimide material is now fully and exclusively qualified by ESA in ACB Belgium’s manufacture of High-Density Interconnect (HDI) Printed Circuit Boards.
NEOTech Grows Industry Lead and Unmatched Expertise in Microelectronics for Aerospace & Defense Applications01/29/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to announce the expansion of its state-of-the-art manufacturing center for Microelectronics as the need for reliable and complex Micro-E circuits continues to grow.