-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 10, 2020 | Nolan Johnson, PCB007Estimated reading time: 1 minute

The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.
Medical Device Standard Reaches New Milestone
Published July 6
Passing the ballot after industry review is a major milestone in the development of a standard. IPC-6012 has accomplished this step. Forward progress on standards in medical devices is very topical right now, and readership showed that interest.
Catching Up With Fane Friberg: Supply Chain Management Expert
Published July 3
“Supply chain” is a key phrase in our sector right now. Everybody is paying attention to the supply chain, and everybody pays attention to Dan Beaulieu, too. So, when Dan interviews a new supply chain subject-matter expert, it was sure to have strong readership.
Understanding MIL-PRF-31032, Part 1
Published July 7
American Standard Circuits’ Anaya Vardya launched a series on MIL-RF-31032 and drew some of the highest readership of the week in just 24 hours. Anaya found a high-interest topic.
AltiumLive 2020 Goes Virtual
Published July 6
Altium’s annual user community conference, AltiumLive, is moving to an online experience this year, like many trade shows and conferences that have responded similarly. This news item makes the top five due to the unique experience that AltiumLive traditionally provides.
Chris Hanson: New Ventec Dialectrics Rated for Higher Temps
Published July 7
With Andy Shaughnessy facilitating the interview, Ventec International Group’s Chris Hanson discusses new IMS materials, including one that is UL-rated for a max operating temperature of 155°C—possibly the highest rating for any IMS dielectric.
Suggested Items
Nolan's Notes: The Next Killer App in Component Manufacturing
05/02/2025 | Nolan Johnson -- Column: Nolan's NotesFor quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.
IPC Excellence in Education Award: Zenaida Valianu
05/01/2025 | Nolan Johnson, I-Connect007Zenaida Valianu is the training manager at IPC who brings more than 25 years of expertise in standards and training development to her role. She has revolutionized IPC certification training programs by significantly enhancing their content with comprehensive curricula and engaging materials. She has also been instrumental in developing essential workforce training courses and contributing to various other initiatives.
A Visit With ‘Flexperts’ Mark Finstad and Nick Koop
05/01/2025 | Joe Fjelstad, Verdant ElectronicsAt IPC APEX EXPO 2025, I chatted with seasoned flex experts Mark Finstad and Nick Koop about "Flexperts" and their roles as leading educators and in the realm of standards development for this increasingly indispensable electronic interconnection technology. They have been teaching about lessons learned and how to successfully navigate the “seas” of flexible circuits to help their students avoid the hazards that have taken down many of their predecessors in the past.
Real Time with... IPC APEX EXPO 2025: Improving the Electronics Industry With Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPODevan Iyer, the Chief Strategist for Advanced Packaging at IPC, shares insights from his recent presentation at the EMS Leadership Summit. The discussion covers the importance of understanding market segments in IoT, power electronics, and high-performance computing. EMS companies are encouraged to specialize, invest wisely, and collaborate to meet customer needs.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.