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RBP is proud to announce the release of MAGNUM N-499, an additional innovation to their PTH process product offering for printed circuit boards. MAGNUM N-499 is a specially designed neutralizer based on hydrogen peroxide that removes residues of manganese dioxide from drilled holes after permanganate desmear in preparation for metallization of multilayer circuit boards. MAGNUM N-499 is effective on a variety of resin materials including high performance epoxy resins and polyimide. It is easily replenished and does not require circuit boards to be dried prior to processing. MAGNUM N-499 should be used in conjunction with MAGNUM K-401 OXIDIZER or MAGNUM N-501 OXIDIZER for optimal performance in the desmear sequence.
Positive Customer Impact
This new product provides the fabricator with wide process latitude with respect to neutralizing manganese dioxide residues that could negatively impact the metallization of high reliability, high aspect ratio printed wiring boards. The process is easily controlled with simple wet analysis and has a long working solution life.
