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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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'IBERICA' is 7th EU Branch for Bowman XRF
July 16, 2020 | Bowman XRFEstimated reading time: Less than a minute
Bowman recently announced the addition of a new EU Branch. Bowman Iberica greatly expands Bowman’s reach and service capability in western Europe. From its headquarters in the Barcelona suburb of Mataro, it will serve new and existing XRF benchtop users throughout Spain and Portugal.
According to owner Domenec Mayoral, the region is ripe with potential for Bowman’s G series benchtop XRF, with its precision video imaging, and ‘bottom-up’ measurement using laser-based auto-focus. Mayoral has more than a quarter century of experience with German-made XRFs, and with Elcometer, a manufacturer of inspection equipment, and DataPhysics, a manufacturer of surface measurement instruments.
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Teledyne's Detector Enables NASA's Europa Clipper MISE Instrument
10/21/2024 | TeledyneTeledyne Technologies Incorporated is pleased to announce its contribution to NASA's successful Europa Clipper launch, which took place at NASA's Kennedy Space Center.
Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
09/11/2024 | SEMIThe SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany.
Teledyne FLIR Delivering Airborne Surveillance Systems to Japan Maritime Self-Defense Force Worth Up to $21 Million
09/09/2024 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, has announced that it is delivering its Star SAFIRE® 380-HLD multi-spectral imaging systems to the Japan Maritime Self-Defense Force (JMSDF) as part of an agreement worth up to $20.8 million.