Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Electronic Interconnect Inc. Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation
July 17, 2020 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
atg Luther & Maelzer GmbH, confirms the order for high-speed bare board testing technology.
The atg A7a, 8 head, double-sided, high speed, auto-load/unload system, for true “lights-out” operation has been ordered and installed at Electronic Interconnect Inc., Elk Grove Village, IL.
atg’s A7a (auto-load/unload) testers utilize 8 flying probe test heads, multiple optical recognition systems, and a wide variety of advanced, high-speed electrical test measurement techniques to electrically test all types of PCB’s for continuity and isolation. Board sizes of 24” x 21’ (or larger), with small pad/fine pitch technology can be tested quickly and easily. Special options, such as, 4-wire Kelvin tests, Hi-pot test, Latent defect test, and others can be provided.
Electronic Interconnect Inc. has been one of the leading manufacturers of printed circuit boards (up to Class 3) for over the last 30 years with a state-of-the-art facility in Elk Grove Village, IL, USA. They are AS9100 Certified, ISO/TS 16949:2009 Certified, ITAR registered, RoHS compliant, and UL approved.
About atg Luther & Maelzer GmbH
With more than 160 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the Printed Circuit Board industry. We have solutions for every application regardless of product type, batch size or technology deployed. Our atg flying probe tester products are renowned for Automation, speed, accuracy, versatility and ease of use, while the Luther & Maelzer universal grid tester product range is known worldwide for high throughput, repeatability, gentle handling and precision accuracy.
Share on:
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.