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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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IPC APEX EXPO Deadline Extended for Virtual Presentation Proposals
July 21, 2020 | IPCEstimated reading time: 1 minute
IPC has extended the deadline for IPC APEX EXPO 2021 technical conference abstracts to Monday, August 31. Because of travel restrictions by some companies and geopolitical areas, IPC is also accepting proposals for virtual presentations. IPC APEX EXPO 2021 technical conference will take place January 26–28 and professional development courses will run January 23–28.
The industry’s premier conference and exhibition for electronics manufacturing in North America, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide.
- Topics being sought within the following categories include
- Factory of the Future Implementation
- Enabling Future Technologies
- Meeting Extreme Requirements
- Conscientious Engineering
- Circuit Design and Component Technologies
- Assembly Processes PCB Fabrication and Materials
- Electronics Materials
- Quality, Reliability, Test and Inspection
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
Visit ipcapexexpo.org/cfp for a comprehensive list of topics. For more information about conference participation or professional development, please contact Toya Richardson at ToyaRichardson@ipc.org or 847-597-2825.
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IPC Webinar: Optimizing Cleaning Products Used in Electronics Manufacturing
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/29/2024 | Nolan Johnson, I-Connect007If you’re in the U.S. today, odds are you’re at home enjoying the aftermath of a Thanksgiving holiday meal. Let me just say that whether you had a Thanksgiving holiday surrounded by family, friends, or both, I hope it was joyous. If you know someone who doesn’t have friends or family with whom to share this time, please reach out and include them. Chronic loneliness can exact a measurable toll on our mental and physical health. Wherever you are on the globe this holiday season, I encourage you to reach out to someone who might be battling loneliness and connect. It will make a difference to them. Not only will it help get you in the mood for your winter holiday of choice, but it’ll be good for your mental health as well.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.