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IPC and iNEMI Sign MOU With Focus on Future of Electronics Manufacturing
August 3, 2020 | IPCEstimated reading time: 1 minute
IPC and International Electronics Manufacturing Initiative (iNEMI), have signed a Memorandum of Understanding (MoU) to collaborate and share information on developing technology roadmaps, organizing forums, establishing new programs, and identifying additional industry needs and projects for the mutual benefit of the membership of both organizations.
“iNEMI is a well-established R&D consortium that has long provided valuable expertise and support in the development of IPC standards,” said Matt Kelly, IPC chief technologist. “This agreement will enable us to work closely together to study the technology needs of the electronics manufacturing supply chain and provide greater benefit to our respective membership.”
“iNEMI and its members value the long-standing relationship with IPC, which dates back 20+ years. This updated MoU reinforces our partnership and the benefits of collaboration across the electronics manufacturing eco-system,” said Marc Benowitz, iNEMI CEO. “We are excited about the opportunities to further our collective impact for the advancement of the industry as a whole.”
IPC and iNEMI have worked successfully for decades on projects requiring “round robin” tests for various programs, have collaborated on each organization’s roadmaps and events and most recently on a best practices document on disinfecting electronics products and assemblies.
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